Award Data

Encapsulation materials are crucial for long-term reliability of high voltage and high temperature power device packaging as they help prevent electrical discharges in air as well as protect the devices against humidity, dirt and shock. However, the currently available commercial encapsulants are severely deficient in their high temperature performance, especially above 250C. Although several diff ...

SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed for spacecraft microelectronics. Leveraging SI2’s extensive additive manufacturing experience, SI2’s low-SWaP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Arra ...

Vertical Photoconductive Semiconductor Switches can be designed to support numerous filaments that simultaneously conduct current. A two dimensional array of current channels can be lithographically patterned on the surface of a substrate to achieve significant power scaling. One of the challenged is coupling the optical trigger signal efficiently into the filament apertures. Nanohmics will desig ...

With significant strides being made on wide bandgap (WBG) semiconductor devices for high-power electronics, there is a concurrent need for packaging encapsulants with reliable long-term performance in a more rigorous operational environment. The WBG power devices are set to be fielded in electric vehicles, aircrafts, spacecrafts, and energy producing systems where working conditions can see temper ...

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Defense MicroElectronics Activity (DMEA) seeks to develop a robust technique to sample and read DNA taggants applied to surfaces of microelectronics supply chain components that employs machine learning methods to develop trained models capable of detecting counterfeit microelectronic parts with > 95% accuracy. To address the need for rapid (< 5 minute) genetic taggant signature profiling rooted i ...

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Physical Sciences Inc. (PSI) will develop a Recycling Fast-Response Atom Interferometer for Navigation (ReFRAIN) as an atom interferometer (AI) accelerometer specially designed to improve inertial navigation systems (INS) on moving platforms.  The ReFRAIN provides sensitivity, dynamic range, bandwidth, and bias stability that matches or exceeds state of the art mechanical accelerometers.  PSI in ...

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