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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. Holographic Projection Laser Marking System (HoloMark)

    SBC: Luminit LLC            Topic: DMEA172002

    To address the DMEA need for Through-Lens Fiducial Marking System, Luminit, LLC proposes to develop a new Holographic Projection Laser Marking System (HoloMark). This proposed device is based on a new design that utilizes Luminit-developed mature components like computer-generated hologram technology. The innovation will enable precise, fast and lower cost marks on any substrate, consistent with t ...

    SBIR Phase I 2018 Department of DefenseDefense Microelectronics Activity
  2. Laser Alignment and Infrared Inspection

    SBC: PHYSICAL OPTICS CORPORATION            Topic: DMEA172002

    To address the DMEAs need to perform failure analysis on microelectronic components using infrared microscope systems to locate areas of interest and then navigate accurately to these same locations in a focused ion beam tool, Physical Optics Corporation (POC) proposes to develop a new Laser Alignment and Infrared Inspection (LAIRI) system. It is based upon the integration of a state-of-the-art co ...

    SBIR Phase I 2018 Department of DefenseDefense Microelectronics Activity
  3. Through-Lens Fiducial Marking System

    SBC: Checkpoint Technologies LLC            Topic: DMEA172002

    The objective of this proposal is to demonstrate the feasibility of the innovative development of a tool that can be integrated into an IR microscope that is able to create fiducial marks on the surface of the backside of silicon.The current state-of-art in semiconductor device analysis involves procedures that begin with the identification of areas of interest under an IR microscope and then thos ...

    SBIR Phase I 2018 Department of DefenseDefense Microelectronics Activity
  4. In-situ Fiducial Marker

    SBC: Hedgefog Research Inc.            Topic: DMEA172002

    To address the DMEA's need for a through-lens fiducial marker technology in semiconductor device inspection, Hedgefog Research Inc. (HFR) proposes to develop a new In-situ Fiducial Marker (IFM), based on laser-activated, electrostatically assisted marking at designated spots. Novel system features in IFM will enable non-destructive fiducial marking (diameter < 5 micron) in real time while operatin ...

    SBIR Phase I 2018 Department of DefenseDefense Microelectronics Activity
  5. Nano-Resolution Three-Dimensional Integrated Circuit Reconstruction System

    SBC: PHYSICAL OPTICS CORPORATION            Topic: DMEA132002

    To address the DMEA need for an accurate identification and analysis of semiconductor materials with high-resolution imaging of integrated circuits (ICs), Physical Optics Corporation (POC) proposes to develop a new Nano-Resolution Three-Dimensional Integrated Circuit Reconstruction System (NEOTERIC) for in situ full reverse engineering of ICs based on swing nano-laminography and a novel X ray filt ...

    SBIR Phase I 2014 Department of DefenseDefense Microelectronics Activity
  6. Highly Adaptive, Plug-and-Play, Fiber Optic Communication System

    SBC: PHYSICAL OPTICS CORPORATION            Topic: DMEA132001

    To address the DMEA?s need for miniature radiofrequency (RF)-over-fiber technology to simultaneously distribute power and provide full duplex RF interface over fiber optic cable between distributed RF nodes, Physical Optics Corporation (POC) proposes to develop a novel, Highly Adaptive, Plug-and-Play, Fiber Optic Communication system (HAVOC) based on an innovative system-in-package (SiP) optical t ...

    SBIR Phase I 2014 Department of DefenseDefense Microelectronics Activity
  7. Miniaturized RF over Fiber using Photonic Integrated Circuits

    SBC: Freedom Photonics LLC            Topic: DMEA132001

    Currently deployed DOD RF-over-fiber systems are hardwired into large platforms, such as ships, submarines, or buildings. The type and size of hardware used (hard wiring, with local power supply and large electronic control boxes) is not suitable for easy and quick deployment by warfighters in tactical situations. Thus, this program looks to exploit full advantages of RF-over-fiber, in situations ...

    SBIR Phase I 2014 Department of DefenseDefense Microelectronics Activity
  8. High Speed, High Resolution X-ray System for Inspecting Integrated Circuits

    SBC: SVXR            Topic: DMEA122001

    The company proposes to design, build and test a prototype system for high-speed x-ray inspection. The system will be based on a new method of x-ray imaging that allows for high-NA x-ray illumination using standard laboratory (non-synchrotron) x-ray sources. A high-resolution, large field-of-view detector permits large field-of-view, high-resolution imaging.

    SBIR Phase II 2014 Department of DefenseDefense Microelectronics Activity

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