Award Data

Technical Product Definition Information. In this activity we created a preliminary technical data package (TDP) at a Level 3 Production per MIL-STD-31000 definition. A TDP is a technical description of an item adequate for supporting an acquisition strategy, development, manufacturing development, production, engineering, and logistics throughout the item's lifecycle. The technical description de ...

This proposal introduces an approach from Brighton Cromwell to Improve product availability and increase competition through the development of Small Business eligible manufacturing utilizing the DLA’s Land and Maritime (L&M) Limited Source National Stock Number (NSN) List. The list contains NSNs with an Annual Demand Value (ADV) >$10K currently sourced with only 1-2 manufacturers. We are offeri ...

Mentis Sciences Inc. proposes to develop Technical Data Packages and generate Source Approval Requests for 13 critically needed components for the Air Launched Cruise Missile engine platform, the F107, which is no longer supported by the OEM, but is scheduled to remain in service through at least 2030. Under previous funding, Mentis has worked with the F107 engineering team to identify and priorit ...

During the Phase I effort, Semandex Networks and its team developed a prototype capability to detect trends in research publications by automatically identifying emerging concepts within the data. The implemented capability provides insights into past and

The purpose of this SBIR effort is to commercialize an innovative method for the production of Modumetal™ discrete parts. The Phase I effort has demonstrated: (1) The low-cost production of monolithic parts of various scales using a net-shape (additive) manufacturing process, (2) An new production process in which cost and production volume are decoupled, and (3) Significant improvement in pr ...

Orora Design Technologies proposes to develop electronic design automation (EDA) tools employing minimally invasive circuit design-based methods to mitigate single event effects (SEEs) for next generation Ultra-DSM CMOS (

In Phase I of this effort we analyzed the structural response of a BLU 109 during typical penetration events. Based on these finite element results, we proposed and demsonstrated a simple robust concept for a passive penetrator sensor that identifies the material being penetrated and also correlates strongly with its underground trajectory. Such a sensor would obviously provide valuable informatio ...