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Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
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Intelligent Automatic Serial Sectioning using Ultra Short Pulse Laser Polygon Scanning
SBC: AEROCYONICS, INC. Topic: DMEA211002Serial sectioning of microelectronics, as needed for performing destructive, high-resolution reverse engineering and failure analysis, faces several challenges, due to the ever-growing miniaturization of features of interest. Some of these challenges are as follows: (1) Current methods of delayering require access to multiple pieces of mechanical equipment such as semi-automated polishing mach ...
SBIR Phase I 2021 Department of DefenseDefense Microelectronics Activity -
Intelligent Ultrafast Laser System for Inspection of Microelectronics
SBC: AEROCYONICS, INC. Topic: DMEA192002Detecting counterfeit electronics is an important area of rising concern for DOD, other federal agencies and the private sector. The advent of cloned chips has called for development of new inspection tools that are capable of inspecting microelectronics down to the nanometer length scale. The state-of-the-art technology in Microscopy currently lacks a one-size-fits-all microelectronics inspection ...
SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity -
Front End of Line and Back End of Line Layer Fabrication Partition
SBC: MAXENTRIC TECHNOLOGIES LLC Topic: DMEA182002To meet the demands of the DMEA182-002 SBIR solicitation (“Front End of Line and Back End of Line Layer Fabrication Partitioning for the Purpose of Design Intellectual Property Protection”), the MaXentric and UCLA team proposes the HIGHFIVE (Heterogeneous Integration Guideline Highlighting Fabrication of Information Veiled Electronics), which provides a practical verification flow using the ci ...
SBIR Phase II 2020 Department of DefenseDefense Microelectronics Activity -
Front End of Line and Back End of Line Layer Fabrication Partitioning for the Purpose of Design Intellectual Property (IP) Protection
SBC: MAXENTRIC TECHNOLOGIES LLC Topic: DMEA182002To meet the demands of the DMEA182-002 SBIR solicitation (“Front End of Line and Back End of Line Layer Fabrication Partitioning for the Purpose of Design Intellectual Property Protection”), the MaXentric and UCLA team proposes the HIGHFIVE (Heterogeneous Integration Guideline Highlighting Fabrication of Information Veiled Electronics), which provides a practical verification flow using the c ...
SBIR Phase I 2019 Department of DefenseDefense Microelectronics Activity -
High Resolution Three-Dimensional Digital Reconstruction of Integrated Circuits
SBC: MAXENTRIC TECHNOLOGIES LLC Topic: DMEA132002MaXentric is pursuing a hybrid non-destructive approach to 3D imaging and reconstruction of very small geometry integrated circuits (ICs). We are combining advanced phase contrast x-ray imaging and computed tomography techniques to identify the 3D structure of the IC with a non-intrusive high-resolution multi-probe near-field technique to capture the active interconnections and devices of the IC. ...
SBIR Phase I 2014 Department of DefenseDefense Microelectronics Activity