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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. "WANshielder – A Network Appliance for Cyber-Resilient ESnet Operation"

    SBC: ARCHITECTURE TECHNOLOGY CORPORATION            Topic: 03a

    The Energy Sciences Network (ESnet) is a high-speed computer network serving United States Department of Energy (DOE) scientists and their HPC collaborators worldwide. The ESnet is a multi- domain network over virtual circuits guaranteeing end-to-end data transfer performance and security on the network. This network structure built using VPN connections and IPSEC tunnels is very similar to milita ...

    SBIR Phase I 2016 Department of Energy
  2. 100 Gb/s Pattern Generator and Comparator

    SBC: Acadia Optronics, Llc            Topic: 40a

    Development of 100 Gb/s network infrastructure, even though nascent, is gathering momentum as a result of the progress made in the 100 Gb/s Ethernet and Optical Transport Network (OTN) standardization efforts. A 100 Gb/s test bed proposed by ESNet is expected to facilitate rapid data transfer between geographically dispersed clouds allowing scientists to use available computing resources regardles ...

    SBIR Phase I 2010 Department of Energy
  3. 100 Gb/s Pattern Generator and Comparator

    SBC: Acadia Optronics, Llc            Topic: 40a

    Network operators are facing sustained bandwidth demands from users and applications in the scientific computing and commercial communities. Hence many are actively migrating to faster 40/100 Gb/s technologies to support large scale transfers. Here the provision of advanced network testing/monitoring capabilities is vital for rapid and effective deployment of these new technologies. However, curr ...

    SBIR Phase II 2011 Department of Energy
  4. 1b Physical layer Authentication of Wired Networks (PAWN)

    SBC: APPLIED ENGINEERING CONCEPTS, INCORPORATED            Topic: 01b

    The convergence of operational technology and information technology systems has left many critical infrastructure deployments vulnerable to cyber attack. Defensive guidelines from organizations such as the U.S. National Institute of Standards and Technology call for the implementation of device authentication. However, there are no technologies currently available to provide device authentication ...

    SBIR Phase I 2019 Department of Energy
  5. 3-D Digital Image Correlation Based Non-Destructive Testing System for Qualification of Additive Manufacturing Parts

    SBC: X-Wave Innovations, Inc.            Topic: NA

    NIST's seeks a high resolution DIC technology for qualification of complex AM parts. To meet this critical need, X-wave Innovations Inc. proposes to develop a 3-Dimentional Digital Image Correlation (3-D DIC) based NDT system. The proposed effort builds upon the success of XII in developing a variety of NDT technologies (including DIC system) for advanced materials evaluation. The success of the p ...

    SBIR Phase I 2017 Department of CommerceNational Institute of Standards and Technology
  6. 3-D Nanofilm Asymmetric Ultracapacitor

    SBC: Ionova Technologies, Inc.            Topic: 15b

    Asymmetric ultracapacitors achieve greater energy density versus today

    STTR Phase II 2010 Department of Energy
  7. 3-D Nanofilm Asymmetric Ultracapacitor

    SBC: Ionova Technologies, Inc.            Topic: 15b

    Asymmetric ultracapacitors achieve greater energy density versus today¿s Electric Double Layer Capacitors (EDLC) by utilizing one activated carbon EDLC electrode and one insertion (battery-like) electrode. Asymmetric ultracapacitors based on non-aqueous electrolytes provide improvements in energy density but they provide no improvement in cost, safety or in environmental impact. Alternatively, aq ...

    STTR Phase I 2009 Department of Energy
  8. 300 mm High Density Temperature Probe Card for Wafer- Level Reliability Testing

    SBC: Celadon Systems Inc.            Topic: N/A

    Historical methods of reliability assessment are less and less effective as device sizes shrink. Already researchers are unable to package the many advanced devices because the act of cutting the wafer and the packaging operation pre-stresses or destroys the devices resulting in unreliable test results. Additionally the increasing cost of fabricating a wafer with advanced integrated circuit techno ...

    SBIR Phase I 2010 Department of CommerceNational Institute of Standards and Technology
  9. 3100F T-EBC Stable Coatings for SiC CMCs

    SBC: TECHNOLOGY ASSESSMENT AND TRANSFER, INC.            Topic: 18a

    Developing a T-EBC coating capable of providing extended performance of sic CMCs in high temperature, water vapor gas turbine engine environments at 3100oF coupled with the need to resist degradation from external sand/ salt ingestion is a daunting challenge. Of all the numerous studies by NASA, universities, private sector companies and other Federal laboratories, rare earth zirconia and hafnia c ...

    SBIR Phase I 2018 Department of Energy
  10. A 3-D Machine Tool Error Modeling System

    SBC: AUTOMATED PRECISION INC.            Topic: N/A

    In response to the increasing demand for better understanding of the manufacturing processes and the machining systems, a new testing standard--ASME B5.54 and a family of new testing instruments have been developed for evaluating the performances of a variety of CNC machining centers. Because of the advancement and versatility of the new instruments, test data are being collected at a much higher ...

    SBIR Phase I 1997 Department of Commerce

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