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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. 3-D Digital Image Correlation Based Non-Destructive Testing System for Qualification of Additive Manufacturing Parts

    SBC: X-Wave Innovations, Inc.            Topic: NA

    NIST's seeks a high resolution DIC technology for qualification of complex AM parts. To meet this critical need, X-wave Innovations Inc. proposes to develop a 3-Dimentional Digital Image Correlation (3-D DIC) based NDT system. The proposed effort builds upon the success of XII in developing a variety of NDT technologies (including DIC system) for advanced materials evaluation. The success of the p ...

    SBIR Phase I 2017 Department of CommerceNational Institute of Standards and Technology
  2. 3-D Printing of Opto-Electronic Components on Flexible Substrates

    SBC: Gemfire Corporation            Topic: N/A

    Not Available The technique of screen printing has been demonstrated to be of practical benefit in numerous engineering applications. Over the past two decades, these benefits have been widely recognized by the electronics industry, as evidenced by the flourishing fields of screen-printed thick-film electronics. Multilayer circuits are now manufactured by the sequential deposition of conductive an ...

    SBIR Phase II 1999 Department of Commerce
  3. 3-D Printing of Opto-Electronic Components on Flexible Substrates

    SBC: Gemfire Corporation            Topic: N/A

    The technique of screen printing has been demonstrated to be of practical benefit in numerous engineering applications. Over the past two decades, these benefits have been widely recognized by the electronics industry, as evidenced by the flourishing fields of screen-printed thick-film electronics. Multilayer circuits are now manufactured by the sequential deposition of conductive and resistive pa ...

    SBIR Phase I 1998 Department of Commerce
  4. 300 mm High Density Temperature Probe Card for Wafer- Level Reliability Testing

    SBC: Celadon Systems Inc.            Topic: N/A

    Historical methods of reliability assessment are less and less effective as device sizes shrink. Already researchers are unable to package the many advanced devices because the act of cutting the wafer and the packaging operation pre-stresses or destroys the devices resulting in unreliable test results. Additionally the increasing cost of fabricating a wafer with advanced integrated circuit techno ...

    SBIR Phase I 2010 Department of CommerceNational Institute of Standards and Technology
  5. : Advanced Tactile Sensing for Dexterous Robot Hands in Industrial Automation and Assembly

    SBC: Syntouch L.L.C.            Topic: 9020173R

    Robotic actuators exceed human speed, accuracy, and strength, but human hands are regarded as the ultimate in dexterity. SynTouch proposes this is due absent human-like tactile sensing and intelligent reflexive behaviors in robots. SynTouch created a multimodal compliant tactile sensor that mimics the sensory ability of the human fingertip (force, vibration and temperature) and algorithms that fil ...

    SBIR Phase I 2013 Department of CommerceNational Institute of Standards and Technology
  6. A 3-D Machine Tool Error Modeling System

    SBC: AUTOMATED PRECISION INC.            Topic: N/A

    In response to the increasing demand for better understanding of the manufacturing processes and the machining systems, a new testing standard--ASME B5.54 and a family of new testing instruments have been developed for evaluating the performances of a variety of CNC machining centers. Because of the advancement and versatility of the new instruments, test data are being collected at a much higher ...

    SBIR Phase I 1997 Department of Commerce
  7. A 50 MHZ SURFACE WAVE SCATTEROMETER FOR THE EVALUATION OF MACHINED CERAMIC SURFACES

    SBC: General Science & Technology            Topic: N/A

    CERAMIC MACHINING GENERATES SUBSURFACE CRACKS THAT CA GROW AND LEAD TO THE FRACTURE OF MACHINED PARTS. IT IS THUS IMPORTANT TO MEASURE THE DAMAGE DUE TO MACHINING. SUCH A MEASUREMENT COULD BE USED TO IMPROVE MACHINING METHODS, AND FOR EHT NONDESTRUCTIVE EVALUATION OF MACHINED PARTS. THE TECHNIQUE WE PROPOSE IS BASED ON USING SCATTERED ULTRASONIC SURFACE WAVES TO MEASURE THE SIZE AND DISTRACTION OF ...

    SBIR Phase I 1993 Department of Commerce
  8. A Broadly Tunable Ultrashort Pulse IR OPO Pumped by a Mode-Locked

    SBC: SCIENCE & ENGINEERING ASSOC., INC.            Topic: N/A

    We propose to develop an innovative, compact ultrafast high brightness laser source, broadly tunable in the infrared for vibrationally-resolved infrared microscopy and other applications. By passive Kerr lens mode-locking of a novel diode-pumped tunable Cr:LiSAF laser, 100fs pulses will be generated at 100 MHZ repetition rate with an average power of 1W. An optical parametric oscillator (OPO) pump ...

    SBIR Phase I 1997 Department of Commerce
  9. A Case-Based Reasoning Approach to Intelligent Tutoring Systems for

    SBC: Stottler Henke Associates, Inc.            Topic: N/A

    An automatic system will be developed to bring the experiences and machine shop environment of experienced machinists to Numerical Control (NC) programmers and Computer Aided Manufacturing (CAM) software operators. This Intelligent Tutoring System (ITS) will teach machining principles and how to apply them with a tailored course of instruction and remediation for use in an office or classroom. The ...

    SBIR Phase I 1997 Department of Commerce
  10. A Compact, Tamper-Resistant, Portable Fingerprint Scanner

    SBC: SBG Labs            Topic: N/A

    With the growing demand for more efficient fingerprinting techniques, live scans are rapidly displacing traditional ink-based methods. Despite improvements in detector and processing technology for capturing and digitizing fingerprints, current equipment falls well short of NIST’s goal of a small, tamper-resistant, battery-powered, handheld scanner. Incumbent equipment suppliers have little comm ...

    SBIR Phase I 2012 Department of CommerceNational Institute of Standards and Technology

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