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The Award database is continually updated throughout the year. As a result, data for FY20 is not expected to be complete until September, 2021.
Failure Avoidance in Microelectronics Due to Coefficient of Thermal Expansion (CTE) Mismatch of Substrates and AdhesivesSBC: GLOBAL ENGINEERING RESEARCH AND TECHNOLOGIES, LLC Topic: MDA14T002
The reliability of electronic packages is of paramount concern in todays electronics industry, and ensuring their thermomechanical integrity is necessary to achieve this reliability. However, this task has become more challenging with miniaturization and the introduction of new materials. Thermal stresses in electronic packages continue to be one of the leading causes of device failure. The pro ...STTR Phase I 2015 Department of DefenseMissile Defense Agency
SBC: Applied Radar, Inc. Topic: MDA08028
Applied Radar has developed a multi-channel wideband digital receiver/exciter (DREX) module denoted as the Single Channel Open Architecture Receiver Exciter (SCORE-X750) which operates at X-band (tunable over 812 GHz) with 750 MHz of instantaneous bandwidth. This DREX module is designed for ground-based radars and can be used in new designs or in retrofit and modernization of existing radars. The ...SBIR Phase II 2015 Department of DefenseMissile Defense Agency