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The Award database is continually updated throughout the year. As a result, data for FY23 is not expected to be complete until September, 2024.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Fabrication of ZrC, HfC, TaC-based Fibrous Monolithic Ceramics for Rocket Propulsion Systems

    SBC: Sensintel Inc.            Topic: N/A

    The goal of this program is to develop a low cost, flexible manufacturing method for the production of high temperature ceramic composites for rocket propulsion systems. The matrix materials selected for this program will be ZrC, HfC, and TaC. These-materials have good oxidation/corrosion and ablation resistance at elevated temperatures, but typically do not possess the thermal shock resistance an ...

    SBIR Phase I 1998 Department of DefenseMissile Defense Agency
  2. LOW INTERFERENCE CROSS POLARIZATION PHASED ARRAY RADIATING ELEMENTS

    SBC: ALPHA OMEGA ELECTROMAGNETICS, LLC            Topic: N/A

    Phased arrays are becoming increasingly desired in communication applications because of their high performance capability and relative ease of installation into mobile platforms. However, present-day phased arrays cannot maintain pure polarization characteristics over a large scan column. This polarization degradation with scan leads to cross-polarization interference in operating in an array e ...

    SBIR Phase I 1998 Department of DefenseAir Force
  3. Microwave 3DIC-Microwave Three Dimensional Integrated Circuit

    SBC: AMCOM Communications, Inc.            Topic: N/A

    The 3DIC concept is based on using multiple levels of thin film dielectric material, each having its own ground plane and microwave circuits, to stack up multiple circuit functions on top of each other. This approach reduces the IC footprint thereby reducing the usage of the semiconductor real estate, leading to substantial reduction in cost as well as improvement in performance. The phase 1 tec ...

    SBIR Phase II 1998 Department of DefenseAir Force
  4. Unique Selected Area Deposition o Copper Onto Aluminum for Multichip Module Applications

    SBC: Brewer Science Incorporated            Topic: N/A

    The inability to deposit copper directly onto aluminum is a longstanding problem in microelectronic manufacturing. Presently, aluminum must be coated with a barrier layer such as TiN to promote copper adhesion and provide good electrical contact between the two metals. This work will demonstrate a nonaqueous galvanic process for selectively depositing a highly adherent copper coating directly o ...

    SBIR Phase II 1998 Department of DefenseAir Force
  5. Bottom Anti-Reflective Coatings (BARCs) for 193 nm Lithography

    SBC: Brewer Science Incorporated            Topic: N/A

    A long-standing trend in the integrated circuit industry is to reduce pattern geometries on semiconductor substrates. To continue this trend, the next exposure wavelength after on-going deep-ultraviolet (248 nm) will be 193 nm. This SBIR Phase I program will identify and develop thermosetting bottom anti-reflective coatings (BARCs) meeting requirements for use with 193 nm unilayer resists. A serie ...

    SBIR Phase I 1998 Department of DefenseMissile Defense Agency
  6. Development of Uncooled Microbolometer Arrays for IR Imaging

    SBC: Brewer Science Incorporated            Topic: N/A

    Ion-implanted, thin polymer films exhibit a large temperature coefficient of resistance which suggests their application in microbolometer arrays used for infrared ( IR) imaging and temperature mapping. Compared to current microbolometer designs which require a series of difficult deposition steps, an ion-implanted polymer-based device requires only a single layer which can be applied by spin coat ...

    SBIR Phase I 1998 Department of DefenseMissile Defense Agency
  7. Low Temperature Homo and Hetero-Epitaxial Growth of SiC on 4H-C and Hexagonal Nb2C Substrates by Plasma

    SBC: BRIMROSE CORPORATION OF AMERICA            Topic: N/A

    Brimrose Corporation's Phase I technical objective is to optimize the Brimrose Corporation's `ECR' Plasma Enhanced CVD processing method for growing homoepitaxially high quality SiC layers on semi-insulating 4H-SiC and heteroepitaxially on closely lattice matched and highly conducting Nb2C substrates (advantageous for fabricating vertical SiC power devices). Lowering of growth temperature will be ...

    SBIR Phase I 1998 Department of DefenseAir Force
  8. Study to define an unmanned vehicle based digital cellular telephone payload system

    SBC: Cerebral Developments, Inc.            Topic: N/A

    There has been continuous improvement in commercial Land Cellular telephone technology since deployment of the first analog system - Advanced Mobile Phone Service - in 1984. Each new generation of air interface embodies increasingly sophisticated signal modulation schemes providing improved spectrum utilization and network capacity. Today, a state-of-the-art commercial digital Cellular ...

    SBIR Phase II 1998 Department of DefenseAir Force
  9. Nano Barium Titanate/Polymer Dielectric Films for High Volt

    SBC: CONDUCTING MATERIALS CORP.            Topic: N/A

    More compact high voltage firing capacitors are required for state of the art detonators used for advanced electronic fuzes. This can be achieved via development of a superior dielectric based upon combination of a processible polymer and a nanoparticulate ceramic material having a very high dielectric constant. While accomplishing this task, the composite must offer a breakdown strength of at l ...

    STTR Phase I 1998 Department of DefenseAir Force
  10. ELECTROCHEMICAL SENSORE FOR NONDESTRUCTIVE INSPECTION OF AD

    SBC: DACCO SCI, INC.            Topic: N/A

    Non-destructive inspection and evaluation (NDI, NDE) of adhesive joint integrity commonly requires separation of an interface or, in limited cases, a kissing unbond that has intimate contact, but no interfacial strength. DACCO SCI, Inc., and Michigan State University propose to adapt an in-situ corrosion sensor to detect the ingress of moisture into a bondline and the subsequent deterioration of ...

    STTR Phase I 1998 Department of DefenseAir Force
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