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Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
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Advanced Electroanalytical Methods for Failure Mode Analysis and Screening of Base Metal Capacitors
SBC: MAINSTREAM ENGINEERING CORP Topic: MDA14T003Over 95% of the multilayer ceramic capacitors manufactured worldwide use base metal electrode (BME) technology and they are one of the key components in much of the modern electronics. BME capacitors have, over the last 20 years, made significant improvements in performance and reliability; making them more competitive for a wide range of applications. However, there remains significant concerns ...
STTR Phase I 2015 Department of DefenseMissile Defense Agency -
A Novel, Microscale, Distributable Sensor Technology for Ionizing Radiation
SBC: CFD RESEARCH CORPORATION Topic: DTRA14B004Terrorist use of radioactive nuclear materials via nuclear and/or radiological dispersion devices (dirty bombs) is a serious threat. Therefore, it is critical to detect the proliferation of nuclear material. Critical challenges facing this objective include: (a) high sensitivity detection of signature emissions (e.g., gamma rays) from common radioactive isotopes behind shielding, and (b) cost-effe ...
STTR Phase I 2015 Department of DefenseDefense Threat Reduction Agency -
A Novel, Microscale, Distributable Sensor Technology for Ionizing Radiation
SBC: CFD RESEARCH CORPORATION Topic: DTRA14B004Terrorist use of radioactive nuclear materials via nuclear and/or radiological dispersion devices (dirty bombs) is a serious threat. Therefore, it is crucial to detect proliferation of nuclear material. Critical challenges include: (a) high sensitivity detection of signature emissions from radioactive isotopes, and (b) cost-effectiveness for deployment of sensor networks across large storage facil ...
STTR Phase II 2019 Department of DefenseDefense Threat Reduction Agency -
An Ultra-High Temperature Ceramic with Improved Fracture Toughness and Oxidation Resistance
SBC: Plasma Processes, LLC Topic: MDA09T002Hypersonic missile defense systems are being designed to reach global threats. During flight, external surfaces are predicted to reach temperatures in excess of 2200C. As a result, innovative, high performance thermal protection systems (TPS) are of great demand. Among ultra-high temperature ceramics (UHTC), it is well known that ZrB2- and HfB2-based materials have high melting temperatures and ...
STTR Phase I 2010 Department of DefenseMissile Defense Agency -
Contamination-free, Ultra-rapid Reactive Chemical Mechanical Polishing (RCMP) of GaN substrates
SBC: Sinmat Inc Topic: MDA09T001Gallium Nitride (GaN) substrates are ideal materials for fabrication of high-power and high-frequency devices based on III-V materials. The current state-of-the-art Chemical Mechanical Polishing (CMP) methods are plagued by several challenges, including, surface charge affects due to surface contamination, and sub-surface damages, which can limit the quality of III-V devices. Furthermore, there is ...
STTR Phase I 2010 Department of DefenseMissile Defense Agency -
Electro Optic Avionic Advanced Guidance, Navigation and Control (GNC) Algorithm Development to Enhance the Lethality of Interceptors Against Maneuveri
SBC: POLARIS SENSOR TECHNOLOGIES INC Topic: MDA08T003This Phase II effort will further develop a technique to improve current seeker discrimination and tracking capabilities using a unique particle filter algorithm (PFA) approach. The advancement represents a significant upgrade to current and future seekers facing advanced threats in stressing environments. Quantifiable improvements over many facets of the current approach have been realized during ...
STTR Phase II 2010 Department of DefenseMissile Defense Agency -
Innovative Polishing Technology for Fabrication of High Performance Epi-ready GaSb Substrates
SBC: Sinmat Inc Topic: MDA12T003Antimony containing III-V semiconducting compounds are particularly attractive for the fabrication of a wide variety of electronic and optoelectronic devices such as photo detectors operating in the long wave infrared wavelength (12-32µm) range. The production of epi quality GaSb wafers still remains one of the important problems for rapid commercialization of GaSb devices. Sinmat Inc. proposes a ...
STTR Phase I 2013 Department of DefenseMissile Defense Agency -
M&S Uncertainty Quantification
SBC: OPTIMIZATION TECHNOLOGIES, INC. Topic: MDA12T007OptTek Systems, Inc (OptTek), proposes an affordable, effective UQ capability for both legacy and new BMDS M & S. The OptTek Team includes research institution partner Oak Ridge National Laboratory (ORNL) and subcontractor RTSync Corporation (RTSync). The proposed BMDS M & S UQ capability maximizes insertability into existing and future MDA BMDS M & S-supported Event processes, analysis methods, a ...
STTR Phase I 2013 Department of DefenseMissile Defense Agency -
M&S Uncertainty Quantification
SBC: NUMERICA CORPORATION Topic: MDA12T007A goal of Uncertainty Quantification (UQ) is to use computer simulation of complex systems to make scientifically informed assessments for high-consequence decisions. Because end-to-end empirical data is difficult to obtain for the Ballistic Missile Defense System (BMDS), computer simulation provides the best method for understanding BMDS capabilities against a wide range of threats. Numerica Co ...
STTR Phase I 2013 Department of DefenseMissile Defense Agency -
Microelectronics Component Adhesive Selection and Design Rules for Failure Avoidance
SBC: CFD RESEARCH CORPORATION Topic: MDA14T002Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...
STTR Phase I 2015 Department of DefenseMissile Defense Agency