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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY21 is not expected to be complete until September, 2022.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

  1. Electrochemical Micro-Capacitors Utilizing Carbon Nanostructures

    SBC: EngeniusMicro, LLC            Topic: DMEA13B001

    Electrochemical double-layer (ECDL) capacitors have tremendous potential as high-power delivery energy storage elements in low-volume and low-weight microelectronics systems. ECDL electrodes based on nanostructured carbon offer the potential for exception

    STTR Phase I 2014 Department of DefenseDefense Microelectronics Activity
  2. High Energy Density Micro-Ultracapacitors through Tunable Electrolyte Confinement and Directional Transport

    SBC: MAINSTREAM ENGINEERING CORPORATION            Topic: DMEA13B001

    The increasing penetration of MEMs devices into the commercial market has lead to an increasing demand for micro-sized electrical energy storage devices to interface with a support them. Electrochemical double layer capacitors hold significant promise as

    STTR Phase I 2014 Department of DefenseDefense Microelectronics Activity
  3. Metrology of thin films on sapphire substrate

    SBC: Optowares Incorporated            Topic: DMEA16B001

    There is a lack of non-destructive metrology tool to measure the thickness of thin films on sapphire substrate due to the transparency of the

    STTR Phase I 2017 Department of DefenseDefense Microelectronics Activity
  4. Computerized Robotic Delayering and Polishing System

    SBC: Spectral Energies, LLC            Topic: DMEA18B001

    The proposed research and technical objectives in this project deal with computerized automatic delayering and polishing system that would be applicable to both commercial and government semiconductor device research and development with applications including Failure Analysis (FA), Fault Isolation (FI), and Reverse Engineering (RE) of semiconductor microelectronic devices. This project could hel ...

    STTR Phase I 2019 Department of DefenseDefense Microelectronics Activity
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