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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.
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Automated In-situ Large-area De-processing of ICs with High ThroughputSBC: MICRONET SOLUTIONS INC. Topic: DMEA18B001
The objective of this proposal is to demonstrate the feasibility of producing an automated delayering and imaging system with end point detection, material density detection with built in neural network error correction. This process, coined fast Automated Delayering-Image Capture System (ADICS) leverages off of the existing Pix2Net which is a proven automated imaging 3D microchip reconstruction ...STTR Phase I 2019 Department of DefenseDefense Microelectronics Activity
Computerized Robotic Delayering and Polishing SystemSBC: SPECTRAL ENERGIES LLC Topic: DMEA18B001
The proposed research and technical objectives in this project deal with computerized automatic delayering and polishing system that would be applicable to both commercial and government semiconductor device research and development with applications including Failure Analysis (FA), Fault Isolation (FI), and Reverse Engineering (RE) of semiconductor microelectronic devices. This project could hel ...STTR Phase I 2019 Department of DefenseDefense Microelectronics Activity