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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

  1. Energy & Power Dense Supercapacitor: On-Chip Integration in MEMs Fabrication

    SBC: MAINSTREAM ENGINEERING CORPORATION            Topic: DMEA21A001

    Due to recent advances in the field of microelectronics, there is an increasing demand for micro-sized energy storage devices that are capable of being incorporated into and provide energy for MEMS devices. In order to continue to enable this technological growth, and the benefits that stem from it, the storage density of electrical energy must also continually be improved, especially with respect ...

    STTR Phase I 2021 Department of DefenseDefense Microelectronics Activity
  2. Graphenated Carbon Nanotube Based MEMS Supercapacitors

    SBC: Faraday Technology, Inc.            Topic: DMEA21A001

    The inherent advantages of MEMS technology, including small size and cost-effective fabrication, make it ideal for numerous application in a wide range of industries ranging from defense, automotive, medical, to consumer industries. For applications that require self-powered MEMS electronics, an integrated energy storage device is required. Due to their small size, excellent cycle life and high po ...

    STTR Phase I 2021 Department of DefenseDefense Microelectronics Activity
  3. Integrated Micro-Supercapacitors via Laser Induced Graphene from Photoresist

    SBC: CORNERSTONE RESEARCH GROUP INC            Topic: DMEA21A001

    While supercapacitors have been demonstrated for decades, the biggest challenge is to develop a reliable fabrication strategy which can integrate these devices with current CMOS (complementary metal oxide semiconductor) technology. Current fabrication technologies do not have good compatibility with other electronic components or cannot manufacture the supercapacitor in a small form factor. Conseq ...

    STTR Phase I 2021 Department of DefenseDefense Microelectronics Activity
  4. Additive Manufacturing Sensor Fusion Technologies for Process Monitoring and Control.

    SBC: ARCTOS Technology Solutions, LLC            Topic: DLA18A001

    This Phase II project aims to assemble the key set of sensor modalities that are needed to reliably view the key process anomalies and properties of laser powder bed fusion. The research team will down-select from the Phase I sensors investigated and integrate the sensors into a sensor fusion software package that facilitates data collection and synchronization, and eventually feedback control of ...

    STTR Phase II 2019 Department of DefenseDefense Logistics Agency
  5. Computerized Robotic Delayering and Polishing System

    SBC: Spectral Energies, LLC            Topic: DMEA18B001

    The proposed research and technical objectives in this project deal with computerized automatic delayering and polishing system that would be applicable to both commercial and government semiconductor device research and development with applications including Failure Analysis (FA), Fault Isolation (FI), and Reverse Engineering (RE) of semiconductor microelectronic devices. This project could hel ...

    STTR Phase I 2019 Department of DefenseDefense Microelectronics Activity
  6. Additive Manufacturing Sensor Fusion Technologies for Process Monitoring and Control.

    SBC: ARCTOS Technology Solutions, LLC            Topic: DLA18A001

    Universal Technology Corporation (UTC) has teamed with the University of Dayton Research Institute (UDRI), Stratonics, and Macy Consulting to demonstrate not only the transitionability into commercial systems, but also to develop the data analytics and monitoring and control requirements to extract the full value fromseveral sensors, including the Stratonics ThermaViz, acoustic and profilometry se ...

    STTR Phase I 2018 Department of DefenseDefense Logistics Agency
  7. Additive Manufacturing Sensor Fusion Technologies for Process Monitoring and Control.

    SBC: SENVOL LLC            Topic: DLA18A001

    The Department of Defense (DoD) has a demand for out-of-production parts to maintain mission readiness of various weapons platforms. Additive manufacturing (AM) is an exciting and promising manufacturing technique that can make out-of-production parts and holds the potential to solve supply chain issues, such as high costs (i.e. for low-volume parts) and sole sourcing risks. The ability of AM to s ...

    STTR Phase I 2018 Department of DefenseDefense Logistics Agency
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