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The Award database is continually updated throughout the year. As a result, data for FY21 is not expected to be complete until September, 2022.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

  1. Additive Manufacturing Sensor Fusion Technologies for Process Monitoring and Control.

    SBC: ARCTOS Technology Solutions, LLC            Topic: DLA18A001

    Universal Technology Corporation (UTC) has teamed with the University of Dayton Research Institute (UDRI), Stratonics, and Macy Consulting to demonstrate not only the transitionability into commercial systems, but also to develop the data analytics and monitoring and control requirements to extract the full value fromseveral sensors, including the Stratonics ThermaViz, acoustic and profilometry se ...

    STTR Phase I 2018 Department of DefenseDefense Logistics Agency
  2. Test Article Printing with Laser Additive Manufacturing (TAP-LAM) for Threat Surrogate Target Production

    SBC: MV Innovative Technologies LLC (DBA: Opt            Topic: MDA17T001

    Optonicus proposes development of the TAP-LAM (Test Article Printing with Laser Additive Manufacturing for Threat Surrogate Target Production) powder bed fusion and directed energy depositions systems. The TAP-LAM metal additive manufacturing system will advance strategic missile defense system testing capabilities by improving 3D printing methods to rapidly produce large-scale threat surrogate ta ...

    STTR Phase I 2018 Department of DefenseMissile Defense Agency
  3. Additive Manufacturing of Metallic Materials for High Strain Rate Applications

    SBC: MRL MATERIALS RESOURCES LLC            Topic: MDA17T001

    Metallic additive manufacturing (AM) is an attractive technology for the production of lethality test articles due to the potential for significantly reduced lead time and manufacturing cost.However, in order to be effective in providing accurate lethality data, the properties of the AM material have to match closely the properties of conventionally manufactured alloys found in real threat targets ...

    STTR Phase I 2018 Department of DefenseMissile Defense Agency
  4. Lightweight Magnesium Components of a Missile Body

    SBC: Terves Inc.            Topic: MDA17T004

    Magnesium alloys have 35% lower density compared to aluminum, with improved temperature stability compared to high strength aluminum.They can also be fabricated with minimum gauge thicknesses considerably thinner than fiber composites, and are weldable, with much higher impact resistance.Traditional magnesium alloys, however, have had lower strengths than more developed aluminum alloys.Powder meta ...

    STTR Phase I 2018 Department of DefenseMissile Defense Agency
  5. Proactive Risk Monitoring Using Predictive Analytics

    SBC: ARCTOS Technology Solutions, LLC            Topic: MDA16T002

    Presently the missile defense systems are using a reactive and program-centric framework for assessing industrial base risk. The Phase I effort focused on developing a wide and deep network algorithm using Industrial Product-Support Vendor (IPV) Gen II program for predicting the probability of failure. The proposed Phase II effort leverages the Phase I work and will focus on three main goals:(1) I ...

    STTR Phase II 2018 Department of DefenseMissile Defense Agency
  6. Simultaneous Multiple Object Detection System

    SBC: Semquest, Inc.            Topic: MDA16T006

    An advanced hit detection technology is needed for MDA that can report impacts at hyper-velocities and at multiple hit locations.We present a technology with a high level of performance that leverages decades of hit technology experience and utilizes existing technologies developed under previous efforts.Our technology offers a low latency non-interpolated direct indicator of multiple hit location ...

    STTR Phase II 2018 Department of DefenseMissile Defense Agency
  7. Innovative Polishing Technology for Fabrication of High Performance Epi-ready GaSb Substrates

    SBC: Sinmat Inc            Topic: MDA12T003

    Antimony containing III-V semiconducting compounds are particularly attractive for the fabrication of a wide variety of electronic and optoelectronic devices such as photo detectors operating in the long wave infrared wavelength (12-32µm) range. The production of epi quality GaSb wafers still remains one of the important problems for rapid commercialization of GaSb devices. Sinmat Inc. proposes a ...

    STTR Phase I 2013 Department of DefenseMissile Defense Agency
  8. M&S Uncertainty Quantification

    SBC: OPTIMIZATION TECHNOLOGIES, INC.            Topic: MDA12T007

    OptTek Systems, Inc (OptTek), proposes an affordable, effective UQ capability for both legacy and new BMDS M & S. The OptTek Team includes research institution partner Oak Ridge National Laboratory (ORNL) and subcontractor RTSync Corporation (RTSync). The proposed BMDS M & S UQ capability maximizes insertability into existing and future MDA BMDS M & S-supported Event processes, analysis methods, a ...

    STTR Phase I 2013 Department of DefenseMissile Defense Agency
  9. M&S Uncertainty Quantification

    SBC: NUMERICA CORP            Topic: MDA12T007

    A goal of Uncertainty Quantification (UQ) is to use computer simulation of complex systems to make scientifically informed assessments for high-consequence decisions. Because end-to-end empirical data is difficult to obtain for the Ballistic Missile Defense System (BMDS), computer simulation provides the best method for understanding BMDS capabilities against a wide range of threats. Numerica Co ...

    STTR Phase I 2013 Department of DefenseMissile Defense Agency
  10. Contamination-free, Ultra-rapid Reactive Chemical Mechanical Polishing (RCMP) of GaN substrates

    SBC: Sinmat Inc            Topic: MDA09T001

    Gallium Nitride (GaN) substrates are ideal materials for fabrication of high-power and high-frequency devices based on III-V materials. The current state-of-the-art Chemical Mechanical Polishing (CMP) methods are plagued by several challenges, including, surface charge affects due to surface contamination, and sub-surface damages, which can limit the quality of III-V devices. Furthermore, there is ...

    STTR Phase I 2010 Department of DefenseMissile Defense Agency
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