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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

  1. A Novel, Microscale, Distributable Sensor Technology for Ionizing Radiation

    SBC: CFD RESEARCH CORP            Topic: DTRA14B004

    Terrorist use of radioactive nuclear materials via nuclear and/or radiological dispersion devices (dirty bombs) is a serious threat. Therefore, it is crucial to detect proliferation of nuclear material. Critical challenges include: (a) high sensitivity detection of signature emissions from radioactive isotopes, and (b) cost-effectiveness for deployment of sensor networks across large storage facil ...

    STTR Phase II 2019 Department of DefenseDefense Threat Reduction Agency
  2. Epitaxial GaN on Flexible Metal Tapes for Low-Cost Transistor Devices

    SBC: IBEAM MATERIALS, INC.            Topic: DEFOA0000941

    GaN-based devices are the basis of a variety of modern electronics applications, especially in optoelectronics and high-frequency / high-power electronics. These devices are based on epitaxial films grown on single-crystal wafers. The single-crystal wafer substrates are limiting because of their size, expense, mechanical properties and availability. If one could make GaN-based devices over large a ...

    STTR Phase II 2016 Department of EnergyARPA-E
  3. Retrofittable and Transparent Super-Insulator for Single-Pane Windows

    SBC: NANOSD, INC.            Topic: DEFOA0001429

    NanoSD, Inc. with its partners will develop a transparent, nanostructured thermally insulating film that can be applied to existing single-pane windows to reduce heat loss. To produce the nanostructured film, the team will create hollow ceramic or polymer nanobubbles and consolidate them into a dense lattice structure using heat and compression. Because it is mostly air, the resulting nanobubble s ...

    STTR Phase II 2016 Department of EnergyARPA-E
  4. Portable and Automated Radiation Effects Test Structures for Advanced Technology Nodes

    SBC: Microelectronics Research Development Corporation            Topic: DTRA16A003

    Micro-RDC will develop portable radiation effects test structures that scales to new process nodes. These structures will enable the investigation of the effects of radiation on the new technology from the material processing level as well as the circuit level. The production of the chosen structures and the development of software to extract the model parameters will form the framework. A suit ...

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
  5. Compact Laser Drivers for Photoconductive Semiconductor Switches

    SBC: ASR Corporation            Topic: DTRA16A004

    A compact laser driver will allow photoconductive semiconductor switches to be used in small EMP simulator "building blocks" (EMPBB). Combined with a battery powered on-board pulsed power system, these EMPBBs will allow the construction of flexible EMP test facilities with nothing more than a single fiber optic timing connection to each EMPBB.

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
  6. Modular Pulse Charger and Laser Triggering System for Large-Scale EMP and HPM Applications

    SBC: Scientific Applications & Research Associates, Inc.            Topic: DTRA16A004

    For effective protection against EMP and HPM threats, it is important to understand the physics of the threats, and also to quantify the effects they have on electrical systems. EMP and HPM vulnerability testing requires delivery of high peak power and electric fields to distant targets. The most practical solution to simulate such environments is to develop a modular, optically-isolated MV-antenn ...

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
  7. Development of powder bed printing (3DP) for rapid and flexible fabrication of energetic material payloads and munitions

    SBC: MAKEL ENGINEERING INC            Topic: DTRA16A001

    This program will demonstrate how additive manufacturing technologies can be used with reactive and high energy materials to create rapid and flexible fabrication of payload and munitions. Our primary approach to this problem will be to use powder bed binder printing techniques to print reactive structures. The anticipated feedstock will consist of composite particles containing all reactant spe ...

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
  8. Rapid Development of Weapon Payloads via Additive Manufacturing

    SBC: MATSYS INC            Topic: DTRA16A001

    MATSYS proposes to adapt emerging additive manufacturing techniques (so-called 3-D Printing) for use with reactive structural materials and demonstrate this capability to rapidly fabricate reactive case. Our concept incorporates two major manufacturing steps: 3D printing of green compacts from pure Al or Al-based reactive powder blend; and Microwave (MW) sintering of green compacts into net-shaped ...

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
  9. Self-fragmenting Structural Reactive Materials (SF-SRM) for High Combustion Efficiency

    SBC: MATSYS INC            Topic: DTRA16A002

    MATSYS proposes to develop, test and evaluate a scalable metal-based reactive structural material that will self-fragment to micron or sub-micron scale fuel particles when subjected to explosive shock loading, resulting in significantly enhanced metal combustion efficiency. Use of reactive material casings offers the potential for several-fold increases in blast and overpressure by generating rapi ...

    STTR Phase I 2016 Department of DefenseDefense Threat Reduction Agency
  10. Epitaxial GaN on flexible metal tapes for low-cost transistor devices

    SBC: IBEAM MATERIALS, INC.            Topic: 1

    GaN-based devices are the basis of a variety of modern electronics applications, especially in optoelectronics and high-frequency / high-power electronics. These devices are based on epitaxial films grown on single-crystal wafers. The single-crystal wafer substrates are limiting because of their size, expense, mechanical properties and availability. If one could make GaN-based devices over large a ...

    STTR Phase I 2013 Department of EnergyARPA-E
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