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The Award database is continually updated throughout the year. As a result, data for FY23 is not expected to be complete until September, 2024.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Rapid and Agile Detection of Counterfeit Electronics using Enhanced ADEC Technology

    SBC: NOKOMIS INC            Topic: DMEA152001

    Counterfeit and maliciously modified electronics can disrupt, disable, and subvert Department of Defense (DoD) weapons systems crucial tonational security. When coupled with the growing sophistication of counterfeits and physical malware, the need for advanced detection technologyis apparent. Conventional screening technologies have proven incapable of robust and reliable counterfeit detection. So ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  2. High-Resolution X-ray Microscopy Image Acquisition, 3D Reconstruction, and Analysis SoftwareSystem

    SBC: Physical Optics Corporation            Topic: DMEA152002

    To address the DMEA need for algorithms and software to accurately analyze data from X-ray microscopy of integrated circuits (ICs), PhysicalOptics Corporation (POC) proposes to develop a new X-ray Microscopy Image Acquisition, 3D Reconstruction, and Analysis Software (XARA)system for rapid identification and mapping of conductors of ICs. It is based on (a) novel swing nanolaminography image acquis ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  3. Analysis of Integrated Circuits Using Limited X-rays

    SBC: LICKENBROCK TECHNOLOGIES, INC.            Topic: DMEA152002

    There exists currently a need to non-destructively evaluate the construction of integrated circuits (ICs) that will ensure the trust of ICs used inmilitary systems, but designed and fabricated under untrusted conditions. An X-ray microscope (XRM) equipped with a lab X-ray source will beused to fill this need. The drawbacks to this system are prohibitively long acquisition times due to reduced X-ra ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  4. Analysis of Integrated Circuits Using Limited X-rays

    SBC: Tangent Sciences LLC            Topic: DMEA152002

    Tangent Sciences develops XRadIC as an automated software framework to non-destructively analyze cutting edge microelectronics using photonflux-limited x-ray microscope systems. XRadIC couples on-the-fly sample scanning with online optimized 2D and 3D image analysis algorithms tomaximize overall system throughput by dynamically minimizing the number of viewing angles and exposure times needed to a ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  5. ZnS Scintillator for High Resolution X-ray Imaging at 9keV

    SBC: CERANOVA CORP            Topic: DMEA15B001

    Novel scintillator materials are needed to address the requirements of fast, high resolution x-ray microscopy, including higher stopping power and light yields. Achieving the required high efficiency and high spatial resolution is challenging and depends strongly on the scintillator characteristics. Knowledge of the details of the trap states can lead to significantly reduced afterglow and fast ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  6. New Sensor for 9 keV HRXM

    SBC: RADIATION MONITORING DEVICES, INC.            Topic: DMEA15B001

    The use of penetrating radiation such as x-rays allows probing materials for their internal structure through direct imaging methods in a non-destructive way. X-rays as more penetrating and with shorter wavelengths than visible light allow imaging internal structures with better resolution. The resolution of details can reach nm sizes. This is realized in High Resolution X-ray Microscopy (HRXM). ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  7. High-Efficiency, High-Resolution Scintillator

    SBC: Physical Optics Corporation            Topic: DMEA15B001

    To address the DMEA need for high-resolution scintillators for X-ray microscopy, Physical Optics Corporation (POC) proposes to develop a new High-Efficiency, High-Resolution Scintillator (HEROS). This proposed technology solution is a thin-film scintillator design, which uses a high-density, high-Z-number material with high X-ray stopping power. Specifically, the innovation in the scintillator m ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  8. Nano-Resolution Three-Dimensional Integrated Circuit ReconstructionSystem

    SBC: Physical Optics Corporation            Topic: DMEA132002

    To address the DMEA need for accurate identification and analysis of semiconductor materials with high-resolution imaging of integratedcircuits (ICs), Physical Optics Corporation (POC) developed and evaluated the feasibility of novel Nano-Resolution Three-DimensionalIntegrated Circuit Reconstruction (NEOTERIC) System for in situ full reverse engineering of ICs based on swing nanolaminography and a ...

    SBIR Phase II 2016 Department of DefenseDefense Microelectronics Activity
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