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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Co-Located Triple Pan QWIP Focal Plane Arrays

    SBC: ADVANCED DEVICE TECHNOLOGY, INC.            Topic: N/A

    We propose to develop Co-located Triple Band Quantum Well Infrared Photodetectors (QWIP) Arrays. The innovative features are: Co-located Triple Band Structure The detection of short waveband (0.7-2.micro.m) midwaveband (3-5.micro.m) and long waveband (8-13.micro.m) signals takes in the same pixel (Co-located pixel). Simultaneous Detection of 3-Color Signals The design is such that detection of 3- ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  2. Thermally Insulated Flexible Composite Cores for Aerospace Applications

    SBC: Infinite Materials & Products, Inc.            Topic: N/A

    Aerospace composite panels containing a core structure usually use an expanded honeycomb of either aluminum, NOMEX, or carbon fiber. These types of composite panels are often used as structure since the honey-comb core provides stiffness in the "Z" direction. However, they provide no thermal insulation value. Aerospace craft operating both inside and outside the earth's atmosphere experience envir ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  3. Environmentally Safe, Sprayable, Waterproof, Rapid Three Minute Room Temperature Cure Resin for the Manufacturing of Aerospace Composite Sealants

    SBC: Infinite Materials & Products, Inc.            Topic: N/A

    Currently manufactured aerospace composites absorb water vapor to varying degrees. This moisture absorption adds weight to the composite, however, it lowers the glass transition temperature. And, subsequently, the ultimate strength of the resin holding the composite together, in the total composite matrix. For aerospace vehicles that slip the bonds of Earth and enter the vacume of space, any compo ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  4. Solid State Raman Image Amplifier

    SBC: LITE CYCLES, INC.            Topic: N/A

    This Small Business Innovative Research Phase I project will focus on the development of a compact, rugged, low-maintenance, cost-effective, all Solid-State Raman Image Amplifier (SSRIA) capable of amplifying low-level LIDAR images and producing gated images with potential gate times of less than a nanosecond. The innovative technology to be implemented is based on a solid-state stimulated Raman s ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  5. Fabrication of a Low-Cost, Lightweight Cu-AlN Composite for Thermal Management

    SBC: ATS-MER, LLC            Topic: N/A

    High thermal conductivity materials with low CTE, and high strength and stiffness are required for high thermal flux applications. In addition, if these materials are relatively inexpensive, lightweight and non-toxic, and have low vapor pressure to survive in space-operating environments, they will be attractive candidates for thermal management in aerospace structures. Such materials are urgently ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  6. A Novel High Thermal Conductivity, Low CTE, Low Weight MMC Substrate for Microelectronics Packaging

    SBC: ATS-MER, LLC            Topic: N/A

    This Small Business Innovation Research Phase I program proposes the development of a high thermal conductivity (470-550 W/mK), low coefficient of thermal expansion (5-8 ppm/K), and low weight (2.9-4.3 g/cc) Cu based metal matrix composite material to produce high performance substrates for microelectronics packaging. The proposed MMC system uses copper as the continuous metal matrix and cubic bor ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  7. Diamond/W Microcathode/Microcathode Array with Very High Field Emission Current Density

    SBC: ATS-MER, LLC            Topic: N/A

    Diamond has recently emerged as a promising material for electron field emission due to its unsurpassed properties of low voltage and room temperature operation, operation robustness, simple design, and reproducibility. However, the present diamond cathodes, which are microcrystalline diamond thin films deposited on macro-substrate (mm to cm size ) suffer a few drawbacks. Only 1-10% or less of the ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  8. Advanced Metal Powder Manufacture for MLCC Applications

    SBC: NANOCHEM RESEARCH, INC.            Topic: N/A

    Sensors, capacitors, and conducting features such as resistors and capacitors on circuit boards are produced from metal and ceramic powders 1-12 These powders are manufactured by liquid phase precipitation routes which often start with reduction of metal salts or by solid-state routes where solid reactants are mixed, heated and then milled. The solid-state processing is generally repeated several ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  9. Pecision Engineered Resistor Arrays from Band-gap Engineered Materials

    SBC: Nanomaterials Research LLC            Topic: N/A

    The performance of existing resistors is unsatisfactory for high frequency, small foot print, low noise electronic and communication applications. These technology limitations can be addressed with resistors prepared from proprietary band-gap engineered, near-molecular scale materials. This project, during Phase I, will establish the proof-of-concept that commercially useful resistor arrays can be ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
  10. Low-cost Manufacturing of Large Area Electronics

    SBC: Nanomaterials Research LLC            Topic: N/A

    Large area electronics are under rapid development given the opportunity they offer to high definition displays and thin film microelectronic devices. Much of the present-day thin film device manufacturing technology is derived from IC fabrication technology. Unfortunately, conventional IC fabrication technology is extremely expensive for large-area electronics. A revolutionary cost reduction in s ...

    SBIR Phase I 1997 Department of DefenseMissile Defense Agency
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