Award Data

CURRENT FRAME BUFFER TECHNOLOGY IS NOT OPTIMIZED FOR USE WITH GENERAL PURPOSE PROCESSORS. THIS PROPOSAL IS FOR A PROGRAM TO DEVELOP A BREADBOARD FRAME BUFFER WHICH IS EFFICIENTLY ACCESSED BY SUCH PROCESSORS. THE FRAME BUFFER IS BASED ON THE VME BUS AND IS SCALABLE TO LARGE AMOUNTS OF IMAGE MEMORY AND VERY FAST IMAGE ACQUISITION RATES. ALL IMAGE DATA IS RANDOMLY ACCESSIBLE AT HIGH SPEED. ANTICIPATE ...

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PHASE I WILL EXPLORE NOVEL WAYS TO APPLY IMPROVED TECHNIQUES USING THE IEEE/ DOD STANDARD VHSIC HARDWARE DESCRIPTION LANGUAGE (VHDL) TO INTEGRATED ENGINEERING METHODS. IN PARTICULAR, IT WILL ENABLE HARDWARE AND SOFTWARE ENGINEERS TO COLLABORATE SIMULTANEOUSLY DURING DEVELOPMENT OF PARALLEL COMPUTING SYSTEMS. SOME SHORTCOMINGS OF VHDL HAVE BEEN OVERCOME BY THE DARPA QUEST PROJECT WITH DISTRIBUTING ...

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CHROMEX proposes to develop a monitor system for plasma etch reactors that will, in the Phase I program, demonstrate much improved endpoint detection when compared to currently availabe systems. The Phase II research will extend the monitoring capabilities to all important plasma parameters. The system will provide the feedback information to the reactor controller necessary to produce a flexible ...

A PROJECT IS PROPOSED TO INVESTIGATE THE FEASIBILITY OF COMBINING A PHASE-CHANGE NON-LINEAR OPTICAL MATERIAL WITH A PHOTOREFRACTIVE MATERIAL IN THIN LAYERS TO ACHIEVE A THREE DIMENSIONAL MASS STORAGE MEDIUM. ORGANIC COMPOUNDS POSSESSING GOOD POLARIZABILITY ALONG WITH COMPOSITION CONDUCIVE TO PHASE CHANGE MECHANICS WILL BE TESTED FOR SHG AND PHASE CHANGE ABILITY, THEN PREPARED IN THIN FILMS ON PHOT ...

Interleukin-8 (IL-8), a newly characterized proinflammatory cytokine, is chemotactic for polymorphonuclear neutrophils (PMNs) and stimulates several other agonist effects, all culminating in accumulation at the site of infection or inflammation and the full plethora of effects, including tissue injury via degradative enzymes and oxygen-derived free radicals. All of these effects are mediated by sp ...

The resolution gap between available chip (sub-micron) and off-chip (100 to 125 micron) will be closed by a new laminate interconnection technology. Semiconductor manufacturing techniques, either on wafer (NChip) or in thin film form (IBM and others), are used to bring line widths and thicknesses into this resolution gap forming 10 micron lines. Problems with this technology include low yields, li ...