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Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
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HTSC CHANNELIZED RECEIVER
SBC: Advanced Technologies/Laboratories Intl Topic: N/ARECENT ADVANCES IN HIGH TEMPERATURE SUPERCONDUCTING (HTSC) THIN FILM TECHNOLOGY ENABLE THE FABRICATION OF LOW-LOSS COMPONENTS THAT WILL IMPROVE THE COST AND PERFORMANCE OF CHANNELIZED RECEIVERS. CHANNELIZED RECEIVERS ARE USED IN SATELLITE TRANSPONDER, ELECTRONIC WARFARE AND ELECTRONICS INTELLIGENCE APPLICATIONS AND ARE COMPRISED OF A GROUP OF NARROW BAND RECEIVERS THAT COVER INDIVIDUAL SLOTS IN A ...
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
HTSC RECEIVE PHASED ARRAY ANTENNA
SBC: Advanced Technologies/Laboratories Intl Topic: N/ASIGNIFICANT SIMPLIFICATION OF MICROWAVE PHASED ARRAY ANTENNA SYSTEM ARCHITECTURES CAN BE ACHIEVED WITH HTSC DEVICE TECHNOLOGY. ELIMINATION OF THE LOW NOISE AMPLIFIERS (LNAS) CAN BE ACCOMPLISHED THROUGH REPLACEMENT OF THE GAAS PHASE SHIFTERS WITH LOW LOSS HTSC COMPONENTS. A REDUCTION IN COMPLEXITY LOWERS BOTH SYSTEM WEIGHT ANDCOST. KEY TO HTSC TECHNOLOGY INSERTION IN PHASED ARRAY ANTENNAS IS THE DE ...
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
PROCESS MONITORING AND CONTROL DURING MOCVD OF FERROELECTRIC THIN FILMS
SBC: ADVANCED FUEL RESEARCH, INC. Topic: N/AFERROELECTRICS (FE) HAVE A LARGE COMMERCIAL POTENTIAL AS PIEZOELECTRIC ELEMENTS, DIELECTRICS FOR CAPACITORS, AND IN OPTICAL GUIDED-WAVE DEVICES. MATERIALS PROCESSING HAS LIMITED APPLICATIONS IN MICROELECTRONICS AND PHOTONICS, HOWEVER, AND FEW METHODS ARE CAPABLE OF DEPOSITING HIGH QUALITY THIN FILMS COMPATIBLE WITH STANDARD SI INTEGRATED CIRCUIT PROCESS TECHNOLOGY. METALORGANIC CHEMICAL VAPOR DEPO ...
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
METALORGANIC ATOMIC LAYER EPITAXY FOR YBACUO SIS DETECTOR FABRICATION
SBC: Apa Optics, Inc. Topic: N/AN/A
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
RELAXOR FERROELECTRIC PB(MG1/3NB2/3)03 FOR THIN FILM CAPACITORS
SBC: TRS CERAMICS, INC. Topic: N/ATHIS PROGRAM'S OBJECTIVE IS TO ESTABLISH THE RELAXOR FERROELECTRIC PB(MG1/2NBS/3)O3 (PMN) AS THE MATERIAL OF CHOICE FOR THIN FILM CAPACITORS IN DRAM AND ELECTRONIC PACKAGING APPLICATIONS.IN CONTRAST TO "NORMAL" FERROELECTRICS, E.G., BATIO3 AND PZT, RELAXORS OFFER HIGH DIELECTRIC CONSTANTS (K>10,000), BROAD PHASE TRANSITIONS,LOW E-FIELD DEPENDENCY OF K, AND LARGE RXC TIME CONSTANTS. IN ADDITION, TH ...
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
ARTIFACT-DESIGN/ENGINEERING KNOWLEDGE ONTOLOGY (ART-DEKO) TOOLSET
SBC: CHI SYSTEMS INC Topic: N/ATHE PROPOSED EFFORT INITIATES RESEARCH TO DEVELOP A SET OF KNOWLEDGE REPRESENTATION TOOLS ADDRESSING THE UNIQUE NEEDS OF INTERDISCIPLINARY TEAMS OF DOMAIN EXPERTS WHO DESIRE TO CREATE AND MAINTAIN SHARED KNOWLEDGE BASES. THE PROPOSED ART-DEKO (ARTIFACT-DESIGN/ENGINEERING KNOWLEDGE ONTOLOGY) TOOLSET WILL PROVIDE INTELLIGENT ASSISTANCE AND MEDIATION TO EXPERTS IN THE COOPERATIVE PROCESS OF DEFINING ...
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
HIGH SPEED PROFILING OF MULTICHIP MODULE INTERCONNECTIONS
SBC: Cyberoptics Corp Topic: N/AAS THE COMPLEXITY AND FUNCTIONALITY OF MICROELECTRONIC COMPONENTS INCREASED, STANDARD PACKAGING AND INTERCONNECTION TECHNOLOGIES LIMIT THE DEVELOPMENT OF ELECTRONIC SYSTEMS. TO INCREASE THE DENSITY OF ELECTRONIC COMPONENTS, NEW TECHNIQUES SUCH AS FLIP-CHIP BONDING HAVE BEEN DESIGNED TO ALLOW MULTI-CHIP MODULES. THIS PACKAGING TECHNIQUE IS CURRENTLY LIMITED BY THE YIELD AND RELIABILITY OF THE ELECT ...
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
MULTI-COMPONENT SYNTHESIS THROUGH ARCHITECTURAL PARTITIONING
SBC: Dasys Inc. Topic: N/AN/A
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
PARALLEL-PROCESSING SUPPORT MODULE
SBC: Entropic Res Laboratory Inc. Topic: N/AN/A
SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency -
SPEECH RECOGNITION PACKAGE
SBC: Entropic Res Laboratory Inc. Topic: N/AN/A
SBIR Phase II 1991 Department of DefenseDefense Advanced Research Projects Agency