List

The proposal program will demonstrate packaging technology in an optical interconnect device consisting of at least 64 parallel interconnections between stages. The packaging will allow a 1 GHz bandwidth, micro-optoelectronic switch to survive in a 50 g (gravity) shock and vibration environment. OptiComp's enabling GaAs "Smart" optoelectronic interconnect modules will be used in the proposed opt ...

The primary problem to be addressed by this SBIR request is the need for development of specific ion sensors that can work reliably in sub-freezing environments to allow unmanned dataloggers to accumulate data on a down-loaded or real-time basis. This would involve re-designing the reference side of the electrode (half-cell) to be rugged enough to survive the conditions imposed upon it while also ...