You are here
Award Data
The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.
-
High-Throughput Manufacturing Methods for Engineered MRI Contrast Agents
SBC: ADVANCED RESEARCH CORPORATION Topic: 9010368RThis project focuses on developing a magnetic resonance imaging (MRI) contrast agent that may increase the detection of tagged cells by a factor of 10-100. The ability to noninvasively track specifically labeled (tagged) cells, enables a researcher or medical treatment professional to dynamically monitor the delivery and targeted application of medicinal and bio-reactive agents.
SBIR Phase I 2015 Department of CommerceNational Institute of Standards and Technology -
Large-Area, High-Uniformity Photodiodes for Infrared Trap Detectors
SBC: AMETHYST RESEARCH INC Topic: 9020168Rmethyst Research Inc. will design, fabricate and test a high uniformity, large area, low noise infrared trap-detector detector for the 1- 4.5 μm wavelength range. This state of the art detector will have a large area (e.g., 1-1.8 cm diameter active area) with a spatial variability of internal quantum efficiency of less than 0.1 % between 1 μm and 4.5 μm. In addition, the internal quantum effici ...
SBIR Phase I 2015 Department of CommerceNational Institute of Standards and Technology -
300 mm High Density Temperature Probe Card for Wafer- Level Reliability Testing
SBC: Celadon Systems Inc. Topic: N/AHistorical methods of reliability assessment are less and less effective as device sizes shrink. Already researchers are unable to package the many advanced devices because the act of cutting the wafer and the packaging operation pre-stresses or destroys the devices resulting in unreliable test results. Additionally the increasing cost of fabricating a wafer with advanced integrated circuit techno ...
SBIR Phase I 2010 Department of CommerceNational Institute of Standards and Technology