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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. POLYIMIDE QUARTZ MULTILAYER BOARD

    SBC: A.i. Technology Inc            Topic: N/A

    A POLYIMIDE BASED POLYMER ALLOY IS PROPOSED TO BE USED AS THE MATRIX FOR A QUARTZ FILLED MULTILAYER CIRCUIT BOARD. POLYIMIDE WHICH HAS THERMAL EXPANSION COEFFICIENT (TEC) OF 30 PPM/DEG C IS SUBSTANTIATLY LOWER THAN THAT OF EPOXY (50-60 PPM/ DEG C). THE POLYMER ALLOY WHICH CONSISTS OF RIGID-RODLIKE MOLECULES, HOWEVER, WILL HAVE TEC AS LOW AS 10-20 PPM/DEG C. QUARTZ FIBER FILLED IN DIFFERENT GEOMETR ...

    SBIR Phase I 1987 Department of DefenseNavy
  2. MANUFACTURING COST ANALYSIS- GALLIUM ARSENIDE MMIC FOR PHASE ARRAY RADAR TRANSMIT/RECEIVER MODULES

    SBC: Anadigics Inc            Topic: N/A

    MMIC YIELD IS THE SIGNIFICANT FACTOR IN DETERMINING BOTH CHIP COST AND LEVEL OF INTEGRATION. IN ORDER TO MAXIMIZE YIELD, IT IS NECESSARY TO ESTABLISH A CONSISTENT, REPRODUCIBLE PROCESS CONTROL, COUPLED WITH CREATIVE CIRCUIT DESIGN TECHNIQUES USED TO CREATE SHIP SETS WHICH ARE TOLERANT TO PROCESS VARIATIONS. A LARGE PROPORTION OF THE FINAL COST FOR THE END PRODUCT IS RELATED TO THE ASSEMBLY AND FIN ...

    SBIR Phase II 1987 Department of DefenseNavy
  3. DETERMINATION OF THE ULTIMATE STRENGTH OF A COMPOSITE MATERIAL BY CONSIDERATION OF CRITICAL MANUFACTURING FLAWS

    SBC: Castle Point Research Technolo            Topic: N/A

    N/A

    SBIR Phase I 1987 Department of DefenseNavy
  4. MULTIPOINT TARGET RADIO FREQUENCY AUGMENTATION

    SBC: ELECTRO-RADIATION, INC.            Topic: N/A

    N/A

    SBIR Phase I 1987 Department of DefenseNavy
  5. TOUGH HIGH MODULUS EPOXY CASTING MATERIALS

    SBC: Gumbs Associates, Inc.            Topic: N/A

    THE OVERALL OBJECTIVE OF THIS PROJECT IS TO DEMONSTRATE THE FEASIBILITY OF PREPARING LOW VISCOSITY, ROOM TEMPERATURE CURABLE, TOUGH, HIGH MODULUS EPOXY CASTING MATERIALS USING POLY(ARYL ETHER KETONES) AND POLY(ARYL ETHER SULFONE KETONE) COPOLYMERS AS IMPACT MODIFIERS. TOUGH, HIGH MODULUS CASTING MATERIALS ARE NOT AVAILABLE. AS THE MODULUS INCREASES, THE BRITTLENESS OF THE CONVENTIONAL PLASTICS ALS ...

    SBIR Phase II 1987 Department of DefenseNavy
  6. J-52 BOLT HOLE REPAIR USING A SHAPE MEMORY ALLOY EXPANSION BUSHING

    SBC: Manhattan Turbine Corp            Topic: N/A

    THIS PROJECT PROPOSES TO REPAIR FATIGUE DAMAGE IN J-52 COMPRESSOR DISCS USING A NICKEL-TITANIUM "SHAPE MEMORY" ALLOY EXPANSION BUSHING. BUSHING INSERTS OF CONVENTIONAL ALLOY MATERIALS CAN RESULT IN SIGNIFICANT IMPROVEMENTS IN FATIGUE STRENGTH AT AMBIENT TEMPERATURES WHEN THE MATERIAL SURROUNDING THE BOLT HOLE IS INITIALLY COLD EXPANDED TO PLACE IT IN COMPRESSION. THE COMPRESSIVE STRESSES SO DEVELO ...

    SBIR Phase I 1987 Department of DefenseNavy
  7. N/A

    SBC: Manhattan Turbine Corp            Topic: N/A

    N/A

    SBIR Phase I 1987 Department of DefenseNavy
  8. THE BEHAVIOR AND DESIGN OF MULTIPLACE CONFIGURED MINEFIELDS

    SBC: Horrigan Analytics            Topic: N/A

    A MULTIPLACE MINEFIELD DESIGN IS A SERIES OF MINEFIELD DESIGNS; THAT IS, A SERIES OF SPECIFICATIONS, ONE FOR EACH OF THE COMPONENT MINEFIELDS OF A MULTIPLACE MINEFIELD, OF THE CORRESPONDING MINEABLE AREA AND OF THE NUMBERS AND KINDS OF MINES AND THEIR DISTRIBUTIONS OF SETTINGS THAT ARE TO BE LAID IN IT. DESIGNING MULTIPLACE MINEFIELDS IS THE CORE OF MULTIPLACE MINEFIELD PLANNING, THE ENTIRE STOCKP ...

    SBIR Phase I 1987 Department of DefenseNavy
  9. DIRECT SURFACE MOUNT IC PACKAGE FOR PCB'S

    SBC: International Micro Industries            Topic: N/A

    THIS EFFORT WILL FOCUS ON LOWERING COST AND IMPROVING PER- FORMANCE BY ELIMINATING CERAMIC AND PLASTIC PACKAGES PRES- USED IN SURFACE MOUNTING SEMICONDUCTOR CHIPS. THE CHIP WILL BE MOUNTED DIRECTLY TO A PREPARED FOOTPRINT ON THE PRINTED CIRCUIT BOARD (PCB) UTILIZING ADVANCED TAPE AUTO- MATED BONDING (TAB) AND NEW CHIP OVERCOATING MATERIALS. A COMMERCIALLY AVAILBLE VLSI SHIP WITH MORE THAN 60 I/O'S ...

    SBIR Phase II 1987 Department of DefenseNavy
  10. INFRARED TARGET SOURCE FOR MISSILE TEST AND EVALUATION

    SBC: Ljf Corp            Topic: N/A

    N/A

    SBIR Phase I 1987 Department of DefenseNavy
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