Award Data

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Efforts to apply active noise and vibration control commercially, while intensifying, continue to be hampered by the cost of the computers required to implement the active algorithms. Currently, the cost of wide-band control is prohibitive for lightly damped systems such as precision structures or highly reverberant acoustic spaces, even if the system has just one canceling actuator and one error ...

As we approach the 21st century, increases in traffic accidents, the creeping paralysis of traffic congestion, and global environmental pollution have focused attention on reconciling the internal combustion engine (ICE) powered vehicle with the needs of the greater society. The solutions to these complex problems require the proper infrastructure and improved electronics technology to bring the I ...

We will demonstrate the capability of scatterometry to provide a process monitor to post exposure bake of chemically amplified photoresist. Two or more scatterometers will be designed that are capable of monitoring the intensities of multiple diffraction orders that result from illuminating device patterns of photoresist. The goal is to demonstrate the capability of scatterometry to provide a PEB ...

A progressive system development is proposed which uses Bayesian methodology for combined detect, track, localize, and classify. The core paradigm focuses on detection followed by various estimation schemes to extract information on contact type, track, and location from the detector. A rapid prototype development using the Generic Multipurpose Processor (GMP) will provide optimal detection ...

The demand for higher performance semiconductor devices is pushing the limits of current materials technology. The development of a high dieletric constant capacitor material with 10 - 100 times the charge storage of SiO2 would allow a flat capacitor cell to be used in 256 Mb DRAMs, and simple stacked capacitors to be adopted for 1 and 4 Gb generations. IBM, TI and Micron have entered into an ARPA ...

All future combustion and electric powered automobiles will be equipped with sensors directly interfaced with control electronics. The control and power electronics for combustion engines will have to cope with high temperatures and adverse environments. Hybrid and electric vehicles require new device technology to handle the high power in their distribution and control systems. High efficiency, l ...

Integration of many different devices on a single silicon carbide (SiC) substrate is necessary to realize the full potential of high temperature or high power devices for markets ranging from industrial and consumer to military systems to transportation power and control. Integration requires that the entire device package, individual devices, contacts and interconnect materials, be ...

The III-V nitrides, (Al, In, Ga)N, are promising materials for high temperature, high power and high frequency devices due to the wide bandgaps, high electron saturation velocity and high electronic mobility transistor (HEMT) structures available in this alloy system. These devices would find wide-spread commercial use as power amplifiers in base station transmitters for personal communications ...

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