Award Data

N/A

Silicon carbide materials will revolutionize semiconductor devices for military and commercial markets. The material's wide bandgap, high electric field breakdown, high thermal conductivity give SiC capabilities that far exceed those of silicon or gallium arsenide. Despite significant progress in silicon carbide development, fundamental defects--most prominently micropipes--persist. If SiC is to s ...

The properties of single-crystal silicon carbide are such that electronics devices from this material have demonstrated remarkable performance characteristics. Despite the material's promise, the material has not yet found acceptance in mainstream device markets because of the material's high cost, among other reasons. This Phase I SBIR proposes an SiC source powder with unique properties which wi ...

A novel technological approach was recently devised by Sumi Tech engineers to fabricate multilayer electronic components, which enables the manufacture of devices with very high volumetric efficiency and reliability. Inexpensive electrode materials such as copper, or aluminum are potential candidates, since the process takes place at relatively low ambient temperature (e.g., less than 400 C), thus ...

The proposed effort focuses on the need for innovative, space realizable, self-contained solid state flexure mechanism for vibration attenuation/isolation. The proposed mechanism is a sealed linear actuator capable of high bandwidth (0-1 kHz) control. A design feasibility study will be performed on the use of piezoelectrics in an innovative flexure mechanism to provide robust vibration attenuation ...

This Phase I project has two primary objectives. The first objective is to evaluate the feasibility of a fully ion implanted fabrication process based on the heterodimensional 2-D MESFET. The new device, the 2-D JFET, will have p+ ion implanted sidegates which laterally modulate a thin, highly doped n-type conducting channel. The 2-D JFET should have excellent high speed, low power characteristics ...

N/A

We propose to design and fabricate an adaptive beam expander that can be switched between two magnifications. Specifically, the beam expander provides diffraction-limited performance for laser radar beams with diameters of 1 mm and 3 mm. The adaptive beam expander is lightweight, and it has no moving parts. Because the beam expander is an afocal system, it operates on both outgoing and incoming be ...

As electronic packaging densities increase, more heat is being generated per unit area. The reliability of electronic components is, therefore, increasingly dependent on the ability to transfer heat. Current chip performance is limited in keeping up with the increased power densities, 30% of which is attributed to packaging materials. The disadvantages of current methods of fabrication of thermal ...

Aluminum nitride is as an ideal thermal management material since it has a very high thermal conductivity and its electrical resistivity is comparable to that of ceramic insulators. Aluminum nitride has thermal conductivity five times greater than alumina and has mechanical strength twice that of alumina and beryllium oxide. The current methods of synthesizing and consolidating aluminum nitride re ...