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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Advanced Predictive Modeling of Radiation Effects in ReRAM Devices based on electrical characterization augmented by imaging data

    SBC: Desert Microtechnology Associates, Inc.            Topic: 20A001

    In an effort to improve the design of radiation hardened electronic components, this proposal explores the feasibility of creating predictive modeling techniques for nanoscale material properties in advanced integrated electrical devices. This study encompasses the collaborative usage of high resolution Transmission Electron Microscope (HR-TEM) data, circuit design targeted electrical data, and ma ...

    STTR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  2. A High-Resolution TEM Thermometry System

    SBC: NANOELECTRONIC IMAGING, INC.            Topic: DMEA192001

    High-resolution, transmission electron microscope, electron beam induced current, EBIC, STEM EBIC, temperature, thermometry

    SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  3. A Modular Cluster Tool for Semiconductor Failure Analysis

    SBC: Square One Systems Design, Inc.            Topic: DMEA172001

    Advanced semiconductor devices are the beating heart of 21st Century technology.The mission critical role that these devices play demands exceptional levels of reliability.When a semiconductor device does fails, it is essential that the cause of the failure is identified as quickly as possible.Because a devices chip is encapsulated in a thermoplastic package, a significant amount of intricate mate ...

    SBIR Phase I 2018 Department of DefenseDefense Microelectronics Activity
  4. A Modular Cluster Tool for Semiconductor Failure Analysis

    SBC: Square One Systems Design, Inc.            Topic: DMEA172001

    Advanced semiconductor devices form the heart of 21st Century technologies. The mission-critical role that these devices play demands exceptional levels of reliability. When a semiconductor device does fail, it is essential that the cause of the failure is identified as quickly as possible, Because of the daunting complexity of an integrated circuit, a significant amount of intricate material rem ...

    SBIR Phase II 2019 Department of DefenseDefense Microelectronics Activity
  5. Analysis of Integrated Circuits Using Limited X-rays

    SBC: LICKENBROCK TECHNOLOGIES, INC.            Topic: DMEA152002

    There exists currently a need to non-destructively evaluate the construction of integrated circuits (ICs) that will ensure the trust of ICs used inmilitary systems, but designed and fabricated under untrusted conditions. An X-ray microscope (XRM) equipped with a lab X-ray source will beused to fill this need. The drawbacks to this system are prohibitively long acquisition times due to reduced X-ra ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  6. Analysis of Integrated Circuits Using Limited X-rays

    SBC: Tangent Sciences LLC            Topic: DMEA152002

    Tangent Sciences develops XRadIC as an automated software framework to non-destructively analyze cutting edge microelectronics using photonflux-limited x-ray microscope systems. XRadIC couples on-the-fly sample scanning with online optimized 2D and 3D image analysis algorithms tomaximize overall system throughput by dynamically minimizing the number of viewing angles and exposure times needed to a ...

    SBIR Phase I 2016 Department of DefenseDefense Microelectronics Activity
  7. Analysis of Integrated Circuits Using Limited X-rays

    SBC: Tangent Sciences LLC            Topic: DMEA152002

    XRadIC establishes an automated software framework to non-destructively analyze cutting edge microelectronics using photon flux-limited x-ray microscope systems. XRadIC couples on-the-fly sample scanning with online optimized 2D and 3D image analysis algorithms to maximize overall system throughput by dynamically minimizing the number of viewing angles and exposure times needed to analyze a given ...

    SBIR Phase II 2018 Department of DefenseDefense Microelectronics Activity
  8. Applications of Machine Learning and Machine Vision to Determine the Authenticity and Security of Microelectronics Parts in Weapons Systems

    SBC: ALITHEON INC            Topic: DMEA192002

    Alitheon proposes a study of the feasibility of the use of its FeaturePrintTM technology to ensure the authenticity and security of microelectronics parts used in weapons systems.

    SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  9. A TEM-Based Thermal and Electronic Imaging System

    SBC: NANOELECTRONIC IMAGING, INC.            Topic: DMEA192001

    The transmission electron microscope (TEM) is the standard high resolution tool for imaging microelectronics. Despite its impressive sensitivity to physical structure (the type, number, and arrangement of atoms), TEM is remarkably inept at detecting electronic and thermal signals, even when equipped with expensive spectroscopic attachments. Electronic and thermal structure determines device functi ...

    SBIR Phase II 2021 Department of DefenseDefense Microelectronics Activity
  10. A Unified Blockchain for FPGA Firmware and Hardware

    SBC: COLVIN RUN NETWORKS, INC            Topic: DMEA182003

    FPGA units in security-sensitive applications need secure manufacturing & configuration methods to combat supply chain interdiction and compromise by adversaries, with robust Third-Party IP provenance traceability. The proposed solution uniquely meets this need with a State of the Art blockchain implementation to build a fit-for-purpose supply chain blockchain (SCBC) optimized for DMEA’s FPGA  ...

    SBIR Phase I 2019 Department of DefenseDefense Microelectronics Activity
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