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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. Global (N4) Free Space Optical Interconnection Packaging Technology

    SBC: OPTICOMP CORP.            Topic: N/A

    The proposal program will demonstrate packaging technology in an optical interconnect device consisting of at least 64 parallel interconnections between stages. The packaging will allow a 1 GHz bandwidth, micro-optoelectronic switch to survive in a 50 g (gravity) shock and vibration environment. OptiComp's enabling GaAs "Smart" optoelectronic interconnect modules will be used in the proposed opt ...

    SBIR Phase II 1996 Department of DefenseNavy
  2. In-Situ Electronic Sensors to Determine Analytes in Cold-Region Soils

    SBC: Phionics, Inc.            Topic: N/A

    The primary problem to be addressed by this SBIR request is the need for development of specific ion sensors that can work reliably in sub-freezing environments to allow unmanned dataloggers to accumulate data on a down-loaded or real-time basis. This would involve re-designing the reference side of the electrode (half-cell) to be rugged enough to survive the conditions imposed upon it while also ...

    SBIR Phase II 1996 Department of DefenseArmy

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