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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. Optoelectronic Packaging Technology for High Speed Switching

    SBC: OPTICOMP CORP.            Topic: N/A

    The principal objective of this proposal is to develop a design for the packaging of the high performance optoelectronic computer (HPOC) module. In addition, we will design the optical interconnect section of the HPOC module, and fabricate and test HPOC module sub-assemblies. A design will be developed for a structure which uses solder engineering to combine the HPOC module components (VCSEL, ar ...

    SBIR Phase I 1996 Department of DefenseMissile Defense Agency

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