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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. Inorganic Confromal Coatings for SIC Packaging

    SBC: TPL, INC.            Topic: N/A

    Glass is an attractive material for microelectronic packaging because it is hermetically sealing, has a low coefficient of thermal expansion, and is compatible with d.c. circuits. Unfortunately, the working temperature of glass is too high for this application. Low-temperature processing of a sol-gel derived, aluminosilicate material for hermetic seals is proposed for electronic packaging. This ...

    SBIR Phase II 1997 Department of DefenseMissile Defense Agency
  2. Ultra-high Dielectric Constant Dielectric Materials

    SBC: TPL, INC.            Topic: N/A

    NON-NUCLEAR APPROACHES ARE SOUGHT FOR HIGH ENERGY DENSITIES FOR SPACE POWER SYSTEMS. ONE CRITICAL COMPONENT TO ACHIEVE IMPROVED PERFORMANCE IS CAPACITOR STORES. THESE ARE DEPENDENT UPON ADVANCES IN LOW LOSS, HIGH ENERGY/HIGH POWER DENSITY STORAGE MATERIALS. A UNIQUE INORGANIC COMPOSITE IS PROPOSED FOR INVESTIGATION AS A HIGH ENERGY DENSITY STORAGE MATERIAL. AN APPROACH IS FORMULATED BASED ON SOL-G ...

    SBIR Phase II 1996 Department of DefenseMissile Defense Agency

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