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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. Commercial Game Development Using HLA and SEDRIS

    SBC: Cybernet Systems Corporation            Topic: N/A

    Significant similarities exist between DoD simulation applications and networked simulation games developed for entertainment. To date, however, there has been no compelling reason for commercial game developers to adopt DoD methods and standards. Interestingly, HLA compares favorably to current commercial solutions like Microsoft's DirectPlay. There is clear benefit to DoD if HLA is embraced b ...

    SBIR Phase I 1997 Department of DefenseOffice of the Secretary of Defense
  2. Data Analysis Tools for HLA Simulations

    SBC: OPTIMETRICS, INC.            Topic: N/A

    OptiMetrics, Inc. proposes to develop real-time monitoring and after action review tools specifically designed to function in advanced HLA simulation environments. The development approach will include: Tailoring tools to user requirements; A highly object-oriented design; A layered design to interface between our software and the external interfaces (e.g., HLA/RTI); A preference for COTS or GOT ...

    SBIR Phase I 1997 Department of DefenseOffice of the Secretary of Defense
  3. Porous Sol-Gel Derived Ceramic Release Agent

    SBC: TPL, INC.            Topic: N/A

    Breathable release coatings that can withstand processing conditions up to 750F are needed for use on ceramic tooling. In situ removal of volatiles in solvent-based composite processing is a critical issue that will enable production of high quality parts at lower cost per part. Current release coatings meet neither the temperature nor the solvent transport requirements of solvent-based composit ...

    SBIR Phase I 1997 Department of DefenseOffice of the Secretary of Defense
  4. Small Lot Repair/Manufacture of Microcircuit Boards by Laser Deposition

    SBC: Cm Consulting            Topic: N/A

    The final prototype of the Microcircuit Board Repair apparatus will be capable of laying down or lifting metal strips with micrometer dimensions. Under real time computer control, the translation stages will be fully automated or manually controlled. The end user will monitor the process in real time using a camera attached with the source. Laying down the metal lines will be done using Laser C ...

    SBIR Phase I 1996 Department of DefenseOffice of the Secretary of Defense

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