You are here

Award Data

For best search results, use the search terms first and then apply the filters
Reset

The Award database is continually updated throughout the year. As a result, data for FY23 is not expected to be complete until September, 2024.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Ultra-Wideband Voltage Controlled Oscillator with Multi-Mode Operations

    SBC: ALPHACORE INC            Topic: DMEA231006

    The U.S. Dept of Defense is seeking a low power (< 30mA @ 3V), US-sourced, ultra-wideband voltage-controlled oscillator (VCO). Fuzing applications that employ Height of Burst (HOB) sensors utilize specialized chipsets that set the operating range and output power for these systems, and different applications require specific parameters given operational environments, input power, form factor, etc. ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  2. DMEA231-004- Modular Cryogenic Dewar for Radiation Testing

    SBC: ADVANCED COOLING TECHNOLOGIES INC            Topic: DMEA231004

    Failure of satellite electronics and other components exposed to natural space environment has been a concern since the early 1960s due to the radiation effects. The radiation effects can be divided into three mechanisms: total ionizing dose (TID), displacement damage (DD), and single event effect (SEE). These failure mechanisms are usually enhanced nonlinearly by other environmental conditions, s ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  3. Synthesizable Register Transfer Logic (RTL) Assertions

    SBC: EDAPTIVE COMPUTING INC            Topic: DMEA221001

    Verification and validation (V&V) of ICs have become progressively difficult as design complexity, the reuse of third-party intellectual property, and malicious attacks on microelectronics have all increased. Given these challenges, the DoD needs automated, user-friendly post-synthesis verification and validation solutions to assure its critical hardware systems. To address this need, ECI presents ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  4. High Current Vertical Photoconductive Semiconductor Switch (PCSS) and Trigger Subsystem

    SBC: Eureka Aerospace            Topic: DMEA231005

    Implementation of multiple parallel current-sharing filaments in high-voltage photoconductive semiconductor switches (PCSS) has been shown to be very effective in scaling the current handling capability of the devices. This approach increases the active current-switching area on the surface of the device to handle higher total current. In this effort, we will develop a vertical geometry PCSS that ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  5. Digital-Output Capacitive Accelerometers for High-G Applications

    SBC: INTERDISCIPLINARY CONSULTING CORP            Topic: DMEA231001

    In response to the 2023 DMEA SBIR Phase I solicitation topic DMEA231-001 titled High-G Accelerometers, the Interdisciplinary Consulting Corporation (IC2) proposes to develop a robust, real-time, tri-axis accelerometer using microelectromechanical systems (MEMS) technology that can provide accurate measurements in high-G environments and survive up to 60 kG. MEMS accelerometers have played a cruci ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  6. Novel Manufacturing Process for Advanced Low-Cost High-Power Epitaxy Silicon Switches

    SBC: RADIATION DETECTION TECHNOLOGIES, INC.            Topic: DMEA231D01

    Currently, the US has limited production facilities for opening switches, e.g., DSRDs, which are manufactured with very outdated manufacturing methods and technology, e.g., based on deep diffusion of dopants into a thinned silicon wafer. The goal of this effort is to develop scaled manufacturing processes, manufacture batch quantities, and enable high-volume manufacturing of semiconductor opening ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  7. Ultra-Wideband, Low-Voltage, Low-power, Low Phase Noise CMOS Voltage Controlled Oscillator

    SBC: TERASPATIAL INC            Topic: DMEA231006

    This proposal is submitted in response to the DoD’s need for a low-power, US-sourced, ultra-wideband VCO designed to work over -55ºC to 125ºC, with high level of programmability and reconfigurability for different applications. This proposal describes a novel design that meet these requirements, building on more than 10 years of prior R&D in this area.

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  8. High Voltage Encapsulant Material

    SBC: LaunchBay LLC            Topic: DMEA231003

    Encapsulation materials are crucial for long-term reliability of high voltage and high temperature power device packaging as they help prevent electrical discharges in air as well as protect the devices against humidity, dirt and shock. However, the currently available commercial encapsulants are severely deficient in their high temperature performance, especially above 250C. Although several diff ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  9. 2nd Phase II Radiation Shielding (SI Technologies)

    SBC: SI2 TECHNOLOGIES, INC            Topic: MDA17012

    SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed for spacecraft microelectronics. Leveraging SI2’s extensive additive manufacturing experience, SI2’s low-SWaP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Arra ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  10. High efficiency vertical photoconductive semiconductor switches (PCSS)

    SBC: NANOHMICS INC            Topic: DMEA231005

    Vertical Photoconductive Semiconductor Switches can be designed to support numerous filaments that simultaneously conduct current. A two dimensional array of current channels can be lithographically patterned on the surface of a substrate to achieve significant power scaling. One of the challenged is coupling the optical trigger signal efficiently into the filament apertures. Nanohmics will desig ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
US Flag An Official Website of the United States Government