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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. HTSC CHANNELIZED RECEIVER

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    RECENT ADVANCES IN HIGH TEMPERATURE SUPERCONDUCTING (HTSC) THIN FILM TECHNOLOGY ENABLE THE FABRICATION OF LOW-LOSS COMPONENTS THAT WILL IMPROVE THE COST AND PERFORMANCE OF CHANNELIZED RECEIVERS. CHANNELIZED RECEIVERS ARE USED IN SATELLITE TRANSPONDER, ELECTRONIC WARFARE AND ELECTRONICS INTELLIGENCE APPLICATIONS AND ARE COMPRISED OF A GROUP OF NARROW BAND RECEIVERS THAT COVER INDIVIDUAL SLOTS IN A ...

    SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency
  2. HTSC RECEIVE PHASED ARRAY ANTENNA

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    SIGNIFICANT SIMPLIFICATION OF MICROWAVE PHASED ARRAY ANTENNA SYSTEM ARCHITECTURES CAN BE ACHIEVED WITH HTSC DEVICE TECHNOLOGY. ELIMINATION OF THE LOW NOISE AMPLIFIERS (LNAS) CAN BE ACCOMPLISHED THROUGH REPLACEMENT OF THE GAAS PHASE SHIFTERS WITH LOW LOSS HTSC COMPONENTS. A REDUCTION IN COMPLEXITY LOWERS BOTH SYSTEM WEIGHT ANDCOST. KEY TO HTSC TECHNOLOGY INSERTION IN PHASED ARRAY ANTENNAS IS THE DE ...

    SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency
  3. Metalorganic Enhanced Ion Milling for BaSrTio3

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    The demand for higher performance semiconductor devices is pushing the limits of current materials technology. The development of a high dieletric constant capacitor material with 10 - 100 times the charge storage of SiO2 would allow a flat capacitor cell to be used in 256 Mb DRAMs, and simple stacked capacitors to be adopted for 1 and 4 Gb generations. IBM, TI and Micron have entered into an ARPA ...

    SBIR Phase I 1994 Department of DefenseDefense Advanced Research Projects Agency
  4. Cost Effective Copper CVD Precursors for ULSI Devices

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    Chemical vapor deposition (CVD) of copper for vias and interconnects is critical to manufacture of next generation high speed ULSI devices and has been extensively investigated over the last few years. Although considerable progress has been made commercialization of this technology is currently impossible due to the high cost of the source reagents. In this Phase I program Advanced Technology Mat ...

    SBIR Phase I 1994 Department of DefenseDefense Advanced Research Projects Agency
  5. Isolation Techniques for High Temperature Integrated Sensor/Electronics Applications

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    Sensors and electronics will become increasingly pervassive as weight, fuel efficiency, cost and emissions requirements put increasing demands on vehicle technology. The development of high temperture, integrated sensors and electronics is necessary to cost-effectively address both civilian and military needs. The arrival of single crystal silicon carbide substrates and high quality epitaxial laye ...

    SBIR Phase I 1994 Department of DefenseDefense Advanced Research Projects Agency
  6. Robust Strain Sensor for Engine Monitoring and Control

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    As we approach the 21st century, increases in traffic accidents, the creeping paralysis of traffic congestion, and global environmental pollution have focused attention on reconciling the internal combustion engine (ICE) powered vehicle with the needs of the greater society. The solutions to these complex problems require the proper infrastructure and improved electronics technology to bring the I ...

    SBIR Phase I 1994 Department of DefenseDefense Advanced Research Projects Agency
  7. High Temperature Electronics for Vehicle Integration

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    All future combustion and electric powered automobiles will be equipped with sensors directly interfaced with control electronics. The control and power electronics for combustion engines will have to cope with high temperatures and adverse environments. Hybrid and electric vehicles require new device technology to handle the high power in their distribution and control systems. High efficiency, l ...

    SBIR Phase I 1994 Department of DefenseDefense Advanced Research Projects Agency
  8. High Brightness Blue LED's

    SBC: Advanced Technologies/Laboratories Intl            Topic: N/A

    N/A

    SBIR Phase I 1994 Department of DefenseDefense Advanced Research Projects Agency
  9. PROCESS MONITORING AND CONTROL DURING MOCVD OF FERROELECTRIC THIN FILMS

    SBC: Advanced Fuel Research, Inc.            Topic: N/A

    FERROELECTRICS (FE) HAVE A LARGE COMMERCIAL POTENTIAL AS PIEZOELECTRIC ELEMENTS, DIELECTRICS FOR CAPACITORS, AND IN OPTICAL GUIDED-WAVE DEVICES. MATERIALS PROCESSING HAS LIMITED APPLICATIONS IN MICROELECTRONICS AND PHOTONICS, HOWEVER, AND FEW METHODS ARE CAPABLE OF DEPOSITING HIGH QUALITY THIN FILMS COMPATIBLE WITH STANDARD SI INTEGRATED CIRCUIT PROCESS TECHNOLOGY. METALORGANIC CHEMICAL VAPOR DEPO ...

    SBIR Phase I 1991 Department of DefenseDefense Advanced Research Projects Agency
  10. Rapid Thermal Annealing Process with Real-Time Monitoring for SiO2 Layer Formation

    SBC: Advanced Fuel Research, Inc.            Topic: N/A

    N/A

    SBIR Phase I 1994 Department of DefenseDefense Advanced Research Projects Agency

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