You are here

Award Data

For best search results, use the search terms first and then apply the filters
Reset

The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. NDT of Fracture Toughness for Pipeline Steels

    SBC: FBS INC            Topic: 180PH1

    NDT of Fracture Toughness for Pipeline Steels3/16/2018Ultrasound-based technology to nondestructively determine fracture toughness of pipeline steels will be developed. Fracture toughness is the material parameter that, along with applied loading and flaw geometry, dictates the critical crack size, and therefore controls the flaw size that must be detected during inspections. A major challenge fac ...

    SBIR Phase II 2023 Department of Transportation
  2. High Voltage Encapsulant Material

    SBC: LaunchBay LLC            Topic: DMEA231003

    Encapsulation materials are crucial for long-term reliability of high voltage and high temperature power device packaging as they help prevent electrical discharges in air as well as protect the devices against humidity, dirt and shock. However, the currently available commercial encapsulants are severely deficient in their high temperature performance, especially above 250C. Although several diff ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  3. 2nd Phase II Radiation Shielding (SI Technologies)

    SBC: SI2 TECHNOLOGIES, INC            Topic: MDA17012

    SI2 Technologies, Inc. (SI2) proposes to develop 3D-printed for spacecraft microelectronics. Leveraging SI2’s extensive additive manufacturing experience, SI2’s low-SWaP, low-cost shielding will be designed to protect both unmounted and board-mounted microelectronics. This approach will accommodate multiple types and sizes of semiconductor packages, including 484 ball Fine Pitch Ball Grid Arra ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  4. Novel Manufacturing Process for Advanced Low-Cost High-Power Epitaxy Silicon Switches

    SBC: RADIATION DETECTION TECHNOLOGIES, INC.            Topic: DMEA231D01

    Currently, the US has limited production facilities for opening switches, e.g., DSRDs, which are manufactured with very outdated manufacturing methods and technology, e.g., based on deep diffusion of dopants into a thinned silicon wafer. The goal of this effort is to develop scaled manufacturing processes, manufacture batch quantities, and enable high-volume manufacturing of semiconductor opening ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  5. Synthesizable Register Transfer Logic (RTL) Assertions

    SBC: EDAPTIVE COMPUTING INC            Topic: DMEA221001

    Verification and validation (V&V) of ICs have become progressively difficult as design complexity, the reuse of third-party intellectual property, and malicious attacks on microelectronics have all increased. Given these challenges, the DoD needs automated, user-friendly post-synthesis verification and validation solutions to assure its critical hardware systems. To address this need, ECI presents ...

    SBIR Phase II 2023 Department of DefenseDefense Microelectronics Activity
  6. Obtaining Accurate Traffic Loading using Bridge Weigh-In-Motion Technology

    SBC: Connected Wise LLC            Topic: 22FH1

    According to a recent survey, 178 million trips are taken across U.S.’s 46,000 structurally deficient bridges every day. Due to concerns over their actual load-carrying capacity, some of these bridges have posted weight and speed restrictions. The lack of enforcement of these load postings is an issue nationwide and presents risks for human lives and costly failures. To address this issue, this ...

    SBIR Phase II 2023 Department of Transportation
  7. High Voltage Package Encapsulants

    SBC: TEXAS RESEARCH INSTITUTE , AUSTIN, INC.            Topic: DMEA231003

    With significant strides being made on wide bandgap (WBG) semiconductor devices for high-power electronics, there is a concurrent need for packaging encapsulants with reliable long-term performance in a more rigorous operational environment. The WBG power devices are set to be fielded in electric vehicles, aircrafts, spacecrafts, and energy producing systems where working conditions can see temper ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  8. Thermo-plastically Formed Resonator Clocks for Ultra High Shock Environments

    SBC: Tanner Research, Inc.            Topic: DMEA231002

    One advanced material found to survive high G-forces and also is defect and grain-size free is thermos-plastic formed (TPF) Bulk Metallic Glasses (BMG). Unlike MEMS-based silicon components which often do not survive high-G, high shock environments, Tanner Research and Yale University have successfully demonstrated thermos-plastic formed (TPF) Bulk Metallic Glass (BMG) use as an alternative materi ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  9. High-G Clock Source

    SBC: Esc Aerospace US, Inc            Topic: DMEA231002

    At the center of most operational systems is TIME. Time enables us to communicate, to synchronize, to control, and to position. An accurate, reliable, low size, weight and power timing source is critical to our esc Aerospace PNT solution NavXTM for accurate and reliable PNT in total GPS denial. However, it is equally critical in a vast number of military and commercial applications. Historica ...

    SBIR Phase I 2023 Department of DefenseDefense Microelectronics Activity
  10. Acoustic Internal Automated Concrete Tie Tester

    SBC: NDT CORPORATION            Topic: 23FR1

    NDT Corp. will take the currently developed ACTT system, which can accurately assess the internal condition of concrete crossties and increase its speed.FRA 23-FR1 requests a system that at high speeds can assess both the internal and external condition of concrete crossties.Currently there are systems that can perform the external assessment at the required speeds.However, there is no system that ...

    SBIR Phase I 2023 Department of Transportation
US Flag An Official Website of the United States Government