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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.
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Microelectronics Component Adhesive Selection and Design Rules for Failure AvoidanceSBC: CFD RESEARCH CORPORATION Topic: MDA14T002
Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...STTR Phase II 2016 Department of DefenseMissile Defense Agency