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SBC: GTD Unlimited LLC Topic: MDA15T002
In this research effort, GTD Unlimited will design tools for efficiently specifying, representing, and analyzing the interactions between control systems in System of Systems (SoS). Our approach will be to model the problem as an uncertain system and analyze the resulting models using control methods. Control methods can be related back to the standard Nyquist criterion for stability, ensuring t ...STTR Phase I 2016 Department of DefenseMissile Defense Agency
SBC: DFR SOLUTIONS, LLC Topic: MDA15T005
DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contaminatio ...STTR Phase I 2016 Department of DefenseMissile Defense Agency
SBC: Intelligent Automation, Inc. Topic: MDA15T005
Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...STTR Phase I 2016 Department of DefenseMissile Defense Agency
Gold-Contaminated Solder-Joint Characterization for Quantifying Risk Associated with Gold EmbrittlementSBC: Enig Associates, Inc. Topic: MDA15T005
Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled sold ...STTR Phase I 2016 Department of DefenseMissile Defense Agency
SBC: OPTO-KNOWLEDGE SYSTEMS INC Topic: MDA15T001
We propose a novel computational framework for discrimination that incorporates sensor data from observations of the engagement and from kill assessment (KA) that such sensors can provide. The KA information is combined with data from other sensors to improve the discrimination decision and to reduce the probability of correlated shots. Approved for Public Release 16-MDA-8620 (1 April 16)STTR Phase I 2016 Department of DefenseMissile Defense Agency
SBC: EXOANALYTIC SOLUTIONS INC Topic: MDA15T001
Missile defense faces the challenges of rapidly maturing and evolving complex threats, possessing capabilities which require the use of all available resources to successfully detect, track and identify the lethal objects. Future performance will rely on multiple sensors such as ground and sea based radars and electro-optical and infrared sensors for target recognition. It is crucial to develop a ...STTR Phase I 2016 Department of DefenseMissile Defense Agency
SBC: FUNDO SCIENCE CORPORATION Topic: MDA14T003
Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...STTR Phase I 2015 Department of DefenseMissile Defense Agency
Failure Avoidance in Microelectronics through Coefficient of Thermal Expansion (CTE) Mismatch Modeling and DesignSBC: Space Micro Inc. Topic: MDA14T002
Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geom ...STTR Phase I 2015 Department of DefenseMissile Defense Agency
SBC: CFD RESEARCH CORPORATION Topic: MDA14T002
Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...STTR Phase I 2015 Department of DefenseMissile Defense Agency