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The Award database is continually updated throughout the year. As a result, data for FY23 is not expected to be complete until September, 2024.
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SBC: CFD RESEARCH CORPORATION Topic: MDA14T002
Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...STTR Phase II 2016 Department of DefenseMissile Defense Agency
SBC: EXOANALYTIC SOLUTIONS INC Topic: MDA15T001
Missile defense faces the challenges of rapidly maturing and evolving complex threats, possessing capabilities which require the use of all available resources to successfully detect, track and identify the lethal objects. Future performance will rely on multiple sensors such as ground and sea based radars and electro-optical and infrared sensors for target recognition. It is crucial to develop a ...STTR Phase I 2016 Department of DefenseMissile Defense Agency
Infectious Disease Diagnostics and Differentiation of Viral vs. Bacterial Infections for Point of Care ApplicationsSBC: GENECAPTURE, INC. Topic: CBD15C001
The modern warfighter faces the constant threat of endemic infections, multi-drug resistant bacteria and Biological Warfare Agents. In order to provide accurate front-line treatment that will curtail the overuse of antibiotics, a rapid and robust moleculaSTTR Phase I 2016 Department of DefenseOffice for Chemical and Biological Defense
SBC: FUNDO SCIENCE CORPORATION Topic: MDA14T003
Miniaturized base metal electrodes (BME) multilayer ceramic capacitors (MLCC) are of great interest for future missile applications as designers are striving to achieve smaller, lighter, cheaper, faster and better electronic assemblies without sacrificing long-term performance. Unfortunately, screening, reliability and qualifications criteria are either not available or not standardized. In the ...STTR Phase I 2015 Department of DefenseMissile Defense Agency
Failure Avoidance in Microelectronics through Coefficient of Thermal Expansion (CTE) Mismatch Modeling and DesignSBC: Space Micro Inc. Topic: MDA14T002
Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geom ...STTR Phase I 2015 Department of DefenseMissile Defense Agency
SBC: Torch Technologies, Inc. Topic: MDA13T002
Leveraging the results of our Phase I work, the Torch Team proposes to execute laboratory-based experiments to elucidate fundamental micro-debris formation mechanisms to improve optical modeling of impacts. Optical signatures from impacts collected over the last decade have identified definitive micro-debris parameter trends. However, current theories have difficulty reproducing these optical ob ...STTR Phase II 2015 Department of DefenseMissile Defense Agency
SBC: DISCERNING TECHNOLOGIES, LLC Topic: OSD11TD1
Empirical-based mathematical framework and computer algorithms, for representing human perception and cognition processes and limitations, which influence the recognition of salient information about rapidly changing events.STTR Phase II 2015 Department of DefenseOffice of the Secretary of Defense
SBC: BRIMROSE TECHNOLOGY CORP Topic: MDA13T009
The objective of this proposal is to demonstrate the feasibility of producing light weight and thermally manageable integrated optical systems suitable for a variety of space and airborne high power directed energy applications. This project will focus on improving two of the most important parts of a high energy mirror design, the highly reflective mirror surface, and the light weight and stiff m ...STTR Phase II 2015 Department of DefenseMissile Defense Agency
SBC: CFD RESEARCH CORPORATION Topic: MDA14T002
Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...STTR Phase I 2015 Department of DefenseMissile Defense Agency