Award Data

DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contaminatio ...

Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...

Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled sold ...

The objective of this proposal is to demonstrate the feasibility of producing light weight and thermally manageable integrated optical systems suitable for a variety of space and airborne high power directed energy applications. This project will focus on improving two of the most important parts of a high energy mirror design, the highly reflective mirror surface, and the light weight and stiff m ...

We propose a novel computational framework for discrimination that incorporates sensor data from observations of the engagement and from kill assessment (KA) that such sensors can provide. The KA information is combined with data from other sensors to improve the discrimination decision and to reduce the probability of correlated shots. Approved for Public Release 16-MDA-8620 (1 April 16)

Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...

Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...

Missile defense faces the challenges of rapidly maturing and evolving complex threats, possessing capabilities which require the use of all available resources to successfully detect, track and identify the lethal objects. Future performance will rely on multiple sensors such as ground and sea based radars and electro-optical and infrared sensors for target recognition. It is crucial to develop a ...

The modern warfighter faces the constant threat of endemic infections, multi-drug resistant bacteria and Biological Warfare Agents. In order to provide accurate front-line treatment that will curtail the overuse of antibiotics, a rapid and robust molecula