Award Data

Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...

Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled sold ...

The modern warfighter faces the constant threat of endemic infections, multi-drug resistant bacteria and Biological Warfare Agents. In order to provide accurate front-line treatment that will curtail the overuse of antibiotics, a rapid and robust molecula

The objective of this proposal is to demonstrate the feasibility of producing light weight and thermally manageable integrated optical systems suitable for airborne and space high power directed energy applications. This project will focus on improving two of the most important parts of a high energy mirror design, the reflective mirror surface, and the multifunctional substrate. Brimrose, in coll ...

The objective of this proposal is to demonstrate the feasibility of producing light weight and thermally manageable integrated optical systems suitable for a variety of space and airborne high power directed energy applications. This project will focus on improving two of the most important parts of a high energy mirror design, the highly reflective mirror surface, and the light weight and stiff m ...

Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...

The aim of this STTR program is to develop protocols to discover rare-earth-free/rare-earth-lean magnetic alloys for replacing rare earth (RE) -based alloys for reducing the dependence of supply from China. The development of non-RE high temperature magnetic materials is very challenging. In Phase I, CFDRC in collaboration with its university partner has demonstrated a proof-of-concept computation ...

Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...

This STTR Phase I proposal proposes to design and develop reactive filter media using nanofiber technology to capture corrosion inducing particulate matter present in coastal region air. The fibrous filter media will be functionalized using ion exchange chemistry which is known to react with salt ions. The media will be characterized for its filtration performance, resistance to airflow, and dus ...

Under the Phase I effort, a set of algorithms were developed/enhanced that, when integrated into a fused track and characterization schema, are capable of realizing the full potential performance afforded by the battle manager having multiple sensors. dBWager is a multi-sensor measurement correlation algorithm that provides highly accurate state vector estimates and provides the correlation of e ...