The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.
SBC: XIA LLC Topic: N/A
As flip-chip bonding becomes the predominant standard in the electronics industry, the increased proximity between dice surfaces and packaging materials will require a significant reduction in the latter's alpha particle activity in order to avoid soft errors. Emission rates at or below 0.001 a/cm2/hr are desirable, which is well below the 0.0050 a/cm2/hr capability of today's best detectors. ...SBIR Phase II 2001 Department of Commerce