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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Non-collinear Wave-front Curvature Range Measurement

    SBC: MIKEL INC            Topic: N/A

    The U.S. submarine force strongly desires an improved situational awareness and a collision avoidance capability based on intercept of active emissions and detection of passive broadband signals. Our Phase I SBIR focused on the development of rapid 3D(range, bearing and depth) localization solution against active emissions detected on existing submarine sensors. The results of our Phase I study sh ...

    SBIR Phase II 2003 Department of DefenseNavy
  2. Polymer-Cased Ammunition for Small Arms and Cannon Ammunition

    SBC: MISSISSIPPI POLYMER TECHNOLOGIES, INC.            Topic: N/A

    Mississippi Polymer Technologies Inc. (MPT) proposes to develop a new generation of polymeric lightweight ammunition for the use by the services. Previous efforts to develop polymer cased ammunition have failed primarily because of problems associatedwith choice of case materials. During Phase I, MPT will execute a thorough survey of the available polymers and processing techniques, followed by ...

    SBIR Phase I 2003 Department of DefenseNavy
  3. High Performance Object Oriented Software for Parallel Embedded Systems

    SBC: MPI SOFTWARE TECHNOLOGY, INC.            Topic: N/A

    This Phase 1 SBIR Proposal entitled

    SBIR Phase I 2003 Department of DefenseAir Force
  4. Global (N4) Free Space Optical Interconnection Packaging Technology

    SBC: OPTICOMP CORP.            Topic: N/A

    The proposal program will demonstrate packaging technology in an optical interconnect device consisting of at least 64 parallel interconnections between stages. The packaging will allow a 1 GHz bandwidth, micro-optoelectronic switch to survive in a 50 g (gravity) shock and vibration environment. OptiComp's enabling GaAs "Smart" optoelectronic interconnect modules will be used in the proposed opt ...

    SBIR Phase II 1996 Department of DefenseNavy
  5. Optoelectronic Packaging Technology for High Speed Switching

    SBC: OPTICOMP CORP.            Topic: N/A

    The principal objective of this proposal is to develop a design for the packaging of the high performance optoelectronic computer (HPOC) module. In addition, we will design the optical interconnect section of the HPOC module, and fabricate and test HPOC module sub-assemblies. A design will be developed for a structure which uses solder engineering to combine the HPOC module components (VCSEL, ar ...

    SBIR Phase I 1996 Department of DefenseMissile Defense Agency
  6. Intelligent Software for Optoelectronic Information Architectures

    SBC: OPTICOMP CORP.            Topic: N/A

    The primary goal of this program is to develop intelligent software mechnaisms which enhance information discovery using a high capacity, scalable, optoelectronic information architecture. By exploiting a high performance optoelectronic computing (HPOC) module platform as a data "processing engine", innovative software mechanisms will be investigated which can manipulate data/knowledge ...

    SBIR Phase I 1996 Department of DefenseAir Force
  7. Optoelectronic Chip-to-Chip Interconnect Technology Development for Radiation Hard Space Applications

    SBC: OPTICOMP CORP.            Topic: N/A

    The primary goal of the proposed Phase II SBIR effort is to develop and fabricate high-speed interconnects utilizing GaAs-based monolithic switching modules and hybrid waveguides in order to relieve the chip-to-chip interconnect bottleneck. The switchingmodules include VCSELs and resonant cavity photodetectors with on-chip multiplexing/demultiplexing. These high-speed interconnects are realized ...

    SBIR Phase II 2003 Department of DefenseAir Force
  8. High Channel Density Interconnect Modules for Air Platforms

    SBC: OPTICOMP CORP.            Topic: N/A

    The primary goal of the proposed Phase I SBIR effort is to develop high channel-density interconnect modules for use in air platforms. This will be accomplished using a unique, monolithic, WDM, optoelectronic module that has a high interconnect density,small form-factor, and is rugged enough to withstand harsh operating environments. OptiComp Corporation occupies a 7,000 square foot facility, wh ...

    SBIR Phase I 2003 Department of DefenseAir Force
  9. Built-In-Test (BIT) Fiber-Optic Transceiver Circuit

    SBC: OPTICOMP CORP.            Topic: N/A

    The primary goal of the proposed Phase I SBIR effort is to investigate various schemes for implementing a built-in test circuit using integrated optoelectronic modules. The circuit will be implemented using OptiComp's (OCC) advanced optoelectronic moduleswhich monolithically integrate VCSELs, detectors, and interconnecting waveguides. Using these unique optoelectronic circuits, advanced built-in ...

    SBIR Phase I 2003 Department of DefenseNavy
  10. In-Situ Electronic Sensors to Determine Analytes in Cold-Region Soils

    SBC: Phionics, Inc.            Topic: N/A

    The primary problem to be addressed by this SBIR request is the need for development of specific ion sensors that can work reliably in sub-freezing environments to allow unmanned dataloggers to accumulate data on a down-loaded or real-time basis. This would involve re-designing the reference side of the electrode (half-cell) to be rugged enough to survive the conditions imposed upon it while also ...

    SBIR Phase II 1996 Department of DefenseArmy
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