Award Data

BMDO seeks development of novel methods to cut tabrication cost of metallic spacecraft and interceptor structures. UTRON proposes to develop an innovative rapid powder consolidation technique called Combustion Driven Dynamic Consolidation (CDDC) to consolidate metal (and other) powders. This technique is versatile and can be applied to various material systems such as metal and alloy powders, inte ...

BMDO seeks development of novel low-to-no outgassing joining/bonding techniques for advanced composites. Explosive welding, employing actual chemical explosives, is a versatile process that can be used, in principle, with any two materials. In some situations involving difficult materials, explosive bonding is the only practical joining method. Typically, a layer of explosive is carefully coated o ...

Reconfigurable computing architectures based on Field Programmable Gate Arrays (FPGAs) offer extaordinary real time processing rates in inexpensive programmable hardware. The key to using FPGAs for reconfigurable computing is to reformulate algorithms in terms of parallel operations that are easily implemented with chains of simple processing elements. Currently available commercial integrated cir ...

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Liquid rocket engine performance can be dramatically improved by increasing the wall temperatures for operation concurrent with a reduction in the component weight. The bipropellant fuel combustion temperatures are between 3000 "approx" 3500 C. The conventional thrusters and exit nozzles made of niobium alloys have a maximum operating temperature limit of 1600 C. A regenerative cooling technolo ...

SiC has exceptionally high thermal conductivity and low linear expansion coefficient to resist thermal distortion, high elastic modulus to resist pressure and bowing distortion. It is lightweight and wear resistant. It also has excellent corrosion resistance and outstanding load bearing characteristics at elevated temperatures. Its hardness is only surpassed by diamond, CBN and boron carbide. As ...

As electronic packaging densities increase, more heat is being generated per unit area. The reliability of electronic components is, therefore, increasingly dependent on the ability to transfer heat. Current chip performance is limited in keeping up with the increased power densities, 30% of which is attributed to packaging materials. The disadvantages of current methods of fabrication of thermal ...

We propose the experimental investigation of a frequency-doubling millimeter-wave amplifier (MWA) that has diverse applications such as short-wavelength radiation sources for sensors and associated systems. The MWA is proposed as a very compact, light-weight RF source in which an electron beam is injected into a deflection cavity operating at the drive frequency. A transverse magnetic field produc ...

A novel technological approach was recently devised by Sumi Tech engineers to fabricate multilayer electronic components, which enables the manufacture of devices with very high volumetric efficiency and reliability. Inexpensive electrode materials such as copper, or aluminum are potential candidates, since the process takes place at relatively low ambient temperature (e.g., less than 400 C), thus ...

Demand for micrometer size metal powders is increasing rapidly as new technologies emerge which can make use of their unique characteristics. One rapidly growing application requiring such powders is metal injection molding, a powder metallurgy process for forming near-net-shape components with higher dimensional accuracy than earlier processes. A significant need also exists for micrometer size s ...