Award Data

The objective of this program is to build AHaH Computing demonstration chips and boards, establishing in the process the technical frameworks for a memristor wafer services business with the Idaho Microfabrication Laboratory (IML) at Boise State University (BSU), Dr. Kris Campbell at BSU, and other fabrication facilities. We believe that AHaH Computing and kT-RAM offer the most practical and robus ...

Space-Division-Multiplexing (SDM) provides a path towards increasing the capacity of fiber optic links.Chiral Photonics has developed proprietary vanishing core technology, which can serves as the basis for multiplexing devices for SDM, called Pi...

ABSTRACT: During Phase I, PaneraTech in partnership with UCLA-TANMS (NSF Center for Translational Applications of Nanoscale Multiferroic Systems) achieved a groundbreaking success by designing a multiferroic small antenna based on continuous spin rotation in ferromagnetic nanoelements in periodic electrode array patterns. Specifically, we developed Finite Elements Method (FEM) models to design nan ...

Advanced infrared imaging techniques are of great interest but associated high costs of III-V and II-VI SWIR and MWIR materials prohibit their widespread deployment and integration with other optoelectronic devices. Freedom Photonics and its team partner...

Tensile-strained germanium tin structures will be developed for infrared emitters and detectors that are compatible with silicon fabrication processes.Optical detectors in the wavelength range of 2-5 microns will be developed by using GeSn on silicon ...

This STTR Phase I project will develop a unified information theoretic framework for multi-sensor target recognition system that enables quantification of information contribution and synergistic combination of features from different sensor modalities. ...

Toyon Research Corp. and the Penn State Univ. propose research and development of innovative algorithms for classifying objects and activities observed in high-dimensional data extracted from multi-sensor motion imagery. The proposed algorithms include novel feature clustering techniques to enable effective characterization of intra-class and inter-class appearance variations in datasets containin ...

Global Circuit Innovations (GCIs) die extraction and reassembly technology(DER) generated initial interest in and demand by the commercial industry through demonstrating the value of remanufacturing an original integrated circuit (IC) from a plas...

This program will develop and analyze a design for a high performance, low cost, one-person-mobile telescope, mount, and camera to track space debris. It will use an innovative optical design, unique optical fabrication technology, and a novel mirror bl...

Next-generation intelligent engines will operate at higher temperatures for increased efficiency and will migrate from centralized to distributed control. There is critical need for sensors for operation at ultra-high temperatures (3000F). Conven...