Award Data

Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress ...

Fine powder thermal battery cathode materials can exhibit challenging flow properties which makes processing with automated presses difficult.Granulating these powders can substantially improve flow properties and reduce the tendency for powder segregation during handling and pressing operations.Additionally, the properties of MgO that lead to good performance in thermal battery separators are not ...

The Iris Technology team which also include Northrop Grumman Aerospace Systems (NGAS) and the University of Wisconsin, is attacking the problem of high-efficiency, low-volume, space-qualified cryocooler systems.The team has a firm starting point by leveraging the Northrop Grumman Microcryocooler and the Iris Technology mLCCE (Miniature Low Cost Control Electronics).TMU enhancement will start with ...

Missile defense faces the challenges of rapidly maturing and evolving complex threats, possessing capabilities which require the use of all available resources to successfully detect, track and identify the lethal objects. Future performance will rely on multiple sensors such as ground and sea based radars and electro-optical and infrared sensors for target recognition. It is crucial to develop a ...