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Award Data

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The Award database is continually updated throughout the year. As a result, data for FY23 is not expected to be complete until September, 2024.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. System of Systems Control Interactions

    SBC: GTD Unlimited LLC            Topic: MDA15T002

    In this research effort, GTD Unlimited will design tools for efficiently specifying, representing, and analyzing the interactions between control systems in System of Systems (SoS). Our approach will be to model the problem as an uncertain system and analyze the resulting models using control methods. Control methods can be related back to the standard Nyquist criterion for stability, ensuring t ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  2. Mechanistic Model Development for Gold Contaminated Solder Joint Reliability

    SBC: DFR SOLUTIONS, LLC            Topic: MDA15T005

    DfR Solutions and the Rochester Institute of Technology (RIT) have formed a team of experts in solder joint reliability and gold embrittlement to perform a series of experiments that will provide the data necessary to create mechanistic reliability models. Critical to any application of these models and of interpreting experimental results is the ability to determine solder joint gold contaminatio ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  3. CCA-SAFE: A Model-Assisted NDE Tool for Failure Analysis of Gold Contaminated Solder Joints

    SBC: Intelligent Automation, Inc.            Topic: MDA15T005

    Gold contamination in Circuit Card Assembly (CCA) solder joints leads to brittle intermetallic compounds (IMCs), which is one of the major factors in solder joint failure. The conventional rule of thumb considers 3 wt% of gold (Au) as a safety threshold, which is not always reliable due to varieties of package platforms, solder types, reflux settings, operational and environmental conditions, etc. ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
  4. Gold-Contaminated Solder-Joint Characterization for Quantifying Risk Associated with Gold Embrittlement

    SBC: Enig Associates, Inc.            Topic: MDA15T005

    Circuit card assembly (CCA) reliability is dependent on solder joints, which join components to printed circuit boards (PCBs). Board users strive to mitigate risks associated with gold-embrittled solder joints. Enig Associates, Inc. (ENIG), in collaboration with Sandia National Laboratories, proposes to develop a risk-forecasting tool for quantifying the risks associated with gold-embrittled sold ...

    STTR Phase I 2016 Department of DefenseMissile Defense Agency
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