Award Data

The transmission electron microscope (TEM) is the standard high resolution tool for imaging microelectronics. Despite its impressive sensitivity to physical structure (the type, number, and arrangement of atoms), TEM is remarkably inept at detecting electronic and thermal signals, even when equipped with expensive spectroscopic attachments. Electronic and thermal structure determines device functi ...

The machine learning for counterfeit detection research program continues the successful Phase 1 feasibility study of applying machine learning to detect FPGA counterfeits. In Phase 1, Graf Research demonstrated the feasibility of implementing a machine learning based counterfeit detection platform for a single FPGA device and representing data characteristic of repackaged counterfeit devices.  T ...

We propose to lay the groundwork for the implementation of a completely integrated SiC BiCMOS/LDMOS technology for integrated control/power circuit applications reliable for operation up to 300 C. Our workplan to accomplish this goal comprises improving device speed and reliability by device engineering, establishing baseline reliability and qualification tests to support and certify development, ...

     This project aims to develop high-temperature (> 300°C) operational dielectrics for SiC CMOS integrated circuits (ICs) technologies in a production-grade fabrication facility in the U.S. All outcomes of this project will directly benefit future implementations of various kinds of high-temperature electronics for defense applications.Increasingly, the development of SiC CMOS-based ICs tha ...

GeneSiC Semiconductor is leveraging recently reported novel techniques for high-performance 4H-silicon carbide MOSFETs, deep in-house expertise in SiC device design and robust device manufacturing facilities at automotive-qualified production foundry X-Fab Texas, for the development of a comprehensive 4H-SiC BiCMOS process platform in this DMEA SBIR program for mission-critical DoD applications an ...

Due to ongoing reduction in feature dimensions and an increase in structure complexity, device delayering is becoming more and more important in detecting electrical faults as well as other phenomena that contribute to device failure. Damage-free de-processing of single layers is critical, but can also be too time consuming to execute manually for various industrial and R&D applications. Automated ...

Serial sectioning of microelectronics, as needed for performing destructive, high-resolution reverse engineering and   failure analysis, faces several challenges, due to the ever-growing miniaturization of features of interest. Some of these challenges are as follows: (1) Current methods of delayering require access to multiple pieces of mechanical equipment such as semi-automated polishing mach ...

The inherent advantages of MEMS technology, including small size and cost-effective fabrication, make it ideal for numerous application in a wide range of industries ranging from defense, automotive, medical, to consumer industries. For applications that require self-powered MEMS electronics, an integrated energy storage device is required. Due to their small size, excellent cycle life and high po ...

While supercapacitors have been demonstrated for decades, the biggest challenge is to develop a reliable fabrication strategy which can integrate these devices with current CMOS (complementary metal oxide semiconductor) technology. Current fabrication technologies do not have good compatibility with other electronic components or cannot manufacture the supercapacitor in a small form factor. Conseq ...

In energy harvesting applications, consumer electronics, and other power-demanding industrial sectors, energy storage with high power and energy efficiency along with long cycling life are key demands. The goal of this project is to fabricate an innovative MEMS-based hybrid supercapacitor with energy density > 100 µWh/cm2 (one of the greatest values reported for micro-supercapacitors), high poten ...