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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

Displaying 204611 - 204620 of 207725 results
  1. Innovative Manufacturing Process Improvements

    SBC: STI ELECTRONICS INC            Topic: MDA04111

    Imbedded Component / Die Technology (IC/DT) A 3-D Modular Designed CCA: The need for high reliability electronic military systems coupled with reduced size and weight factors has demanded the evolution of circuit card manufacturing technology for miniturizing and assembling printed circuit card assemblies into standard modular designed configurations. IC/DT will advance electronics manufacturing t ...

    SBIR Phase I 2005 Department of DefenseMissile Defense Agency
  2. Innovative Manufacturing Process Improvements

    SBC: STI ELECTRONICS INC            Topic: MDA04111

    Miniaturizing electronic packaging is critical to the advancement of electronics design and capability. Smaller, denser packages are required to increase data processing capability of current systems. The objective of the research project is to continue development of increased signal processing capability for interceptor electronics while maintaining low junction temperatures for improved perfo ...

    SBIR Phase II 2006 Department of DefenseMissile Defense Agency
  3. Integrated Avionics Manufacturing Concept: Imbedded Component/Die Technology (IC/DT)

    SBC: STI ELECTRONICS INC            Topic: MDA05019

    The need for increased reliability coupled with reduced size and weight has demanded the evolution of manufacturing process technologies for printed circuit board assembly. Imbedded Component/Die Technology (IC/DT) will advance electronics packaging to the next level by transforming two-dimensional component placement into a three-dimensional (3-D) assembly with integrated thermal management. IC ...

    SBIR Phase I 2006 Department of DefenseMissile Defense Agency
  4. Advanced, Low Cost, Integrated Avionics

    SBC: STI ELECTRONICS INC            Topic: MDA04116

    Imbedded Component / Die Technology (IC/DT) A 3-D Modular Designed CCA for AVIONIC APPLICATIONS: The need for high reliability electronic military avionic systems coupled with reduced size and weight factors has demanded the evolution of circuit card manufacturing technology for miniaturizing and assembling printed circuit card assemblies into standard modular designed configurations. IC/DT will a ...

    SBIR Phase I 2005 Department of DefenseMissile Defense Agency
  5. Advanced, Low Cost, Integrated Avionics

    SBC: STI ELECTRONICS INC            Topic: MDA04116

    Imbedded Component/Die Technology provides a complete solution for mission critical electronics coupling high-density electronics with passive thermal management. Imbedded Component/Die Technology allows the 3-D configuration of multiple systems thus achieving the cost/weight ratio advantage of using the smallest form and fit factor components available in a circuit card assembly. The objective o ...

    SBIR Phase II 2006 Department of DefenseMissile Defense Agency
  6. Integrated Avionics Manufacturing Concept: Imbedded Component/Die Technology (IC/DT)

    SBC: STI ELECTRONICS INC            Topic: MDA05019

    The need for increased reliability coupled with reduced size and weight has demanded the evolution of manufacturing process technologies for printed circuit board assembly. Imbedded Component/Die Technology (IC/DT) will advance electronics packaging to the next level by transforming 2-D component placement into a 3-D assembly with integrated thermal management. In Phase I, a conceptual design of ...

    SBIR Phase II 2007 Department of DefenseMissile Defense Agency
  7. Advanced Packaging Concept: Imbedded Component/Die Technology (IC/DT)

    SBC: STI ELECTRONICS INC            Topic: MDA05019

    Increasing requirements for software defined radios (SDR), such as those developed for Joint Tactical Radio System (JTRS), call for reduced size, lighter weight hardware in which to implement this next generation radio communication system. Today’s conventional circuit card assembly (CCA) packaging technologies, i.e. plated through-hole (PTH) and surface mount technology (SMT), are struggling t ...

    SBIR Phase II 2007 Department of DefenseNavy
  8. Developing Novel Dual CRF-R1/Orexin-1 Receptor Antagonists for Tobacco Dependence

    SBC: HAGER BIOSCIENCES, LLC            Topic: NIDA

    DESCRIPTION (provided by applicant): Tobacco use is now recognized as the single most responsible cause of avoidable death worldwide representing approximately 10% of all deaths globally. Directly or indirectly, long term tobacco use has been implicated incomplex major health disorders such as cancer, stroke, cardiovascular diseases, and mental disorders. In the USA alone, 30% of all cancer deaths ...

    STTR Phase I 2011 Department of Health and Human ServicesNational Institutes of Health
  9. MULTI-TARGETED COUNTERMEASURES AGAINST ACUTE AND DELAYED EFFECTS OF OP EXPOSURE

    SBC: HAGER BIOSCIENCES, LLC            Topic: NIEHS

    DESCRIPTION (provided by applicant): Organophosphate (OP) nerve agents have been deployed as weapons of mass destruction in warfare arenas and in recent terrorist attacks; posing significant risks to military personnel, civilians, first responders and healthcare provider. The classic OP nerve agents such as sarin, soman, tabun, and VX, along with related OP pesticides represent some of the most to ...

    SBIR Phase I 2013 Department of Health and Human ServicesNational Institutes of Health
  10. Stress Testing Robustness to Exceptional Situations in Simulation

    SBC: EDGE CASE RESEARCH INC            Topic: OSD141AU4

    Recent advancements in sensor simulation tools [2] have improved our ability to model radar, lidar, camera, and GPS with software/hardware in the loop. Of course, our ability to model the physics of heavy trucks [3] is quite mature as well. To address the challenge of developing the STE, we will provide our autonomy algorithms as Government Furnished Equipment (GFE). The focus of this topic ...

    SBIR Phase II 2015 Department of DefenseOffice of the Secretary of Defense
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