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The Award database is continually updated throughout the year. As a result, data for FY24 is not expected to be complete until March, 2025.

Download all SBIR.gov award data either with award abstracts (290MB) or without award abstracts (65MB). A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.

The SBIR.gov award data files now contain the required fields to calculate award timeliness for individual awards or for an agency or branch. Additional information on calculating award timeliness is available on the Data Resource Page.

  1. Rapid, Portable, Surface Texture Based Component Classifier (RAPSTEC) System

    SBC: CHROMOLOGIC LLC            Topic: DMEA192002

    In order to meet the Defense Microelectronics Activity (DMEA) need to support the ongoing Department of Defense (DOD) challenge to ensure the authenticity and security of microelectronics parts within its supply chain, ChromoLogic LLC (CLL) proposed, developed and demonstrated a Phase I RAPSTEC system. RAPSTEC is based on a machine vision system designed to capture the surface features of a microe ...

    SBIR Phase II 2021 Department of DefenseDefense Microelectronics Activity
  2. Machine Learning Applied to Counterfeit Detection

    SBC: GRAF RESEARCH CORPORATION            Topic: DMEA192002

    The machine learning for counterfeit detection research program continues the successful Phase 1 feasibility study of applying machine learning to detect FPGA counterfeits. In Phase 1, Graf Research demonstrated the feasibility of implementing a machine learning based counterfeit detection platform for a single FPGA device and representing data characteristic of repackaged counterfeit devices.  T ...

    SBIR Phase II 2021 Department of DefenseDefense Microelectronics Activity
  3. A TEM-Based Thermal and Electronic Imaging System

    SBC: NANOELECTRONIC IMAGING, INC.            Topic: DMEA192001

    The transmission electron microscope (TEM) is the standard high resolution tool for imaging microelectronics. Despite its impressive sensitivity to physical structure (the type, number, and arrangement of atoms), TEM is remarkably inept at detecting electronic and thermal signals, even when equipped with expensive spectroscopic attachments. Electronic and thermal structure determines device functi ...

    SBIR Phase II 2021 Department of DefenseDefense Microelectronics Activity
  4. Advanced Predictive Modeling of Radiation Effects in ReRAM Devices based on electrical characterization augmented by imaging data

    SBC: Desert Microtechnology Associates, Inc.            Topic: 20A001

    In an effort to improve the design of radiation hardened electronic components, this proposal explores the feasibility of creating predictive modeling techniques for nanoscale material properties in advanced integrated electrical devices. This study encompasses the collaborative usage of high resolution Transmission Electron Microscope (HR-TEM) data, circuit design targeted electrical data, and ma ...

    STTR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  5. Investigation of Radiation Effects in Advanced Microelectronic Devices for developing predictive models of degradation

    SBC: CFD RESEARCH CORPORATION            Topic: 20A001

    Radiation effects in microelectronic components are a significant concern for the reliability of DoD systems that operate at high altitudes or in outer space. Typical characterization efforts focus on macroscale degradation signatures from electrical measurements at device terminals. However, a comprehensive analysis of radiation-induced physical defects is not possible based solely on terminal me ...

    STTR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  6. Development of Atomic Scale Tomography for Quantification of Radiation Induced Defects in Microelectronic Devices

    SBC: HUMMINGBIRD PRECISION MACHINE CO.            Topic: 20A001

    Dimensional and compositional metrology of small-scale microelectronics, less than 22 nm, is becoming increasingly difficult as the architecture of these devices is becoming more complex. Key metrological measurements of Fin devices require 3-D metrology at less than 0.5 nm spatial resolution as well as single atom characterization to identify device composition and chemical distributions. This is ...

    STTR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  7. Predictive device modeling for radiation effects through machine learning

    SBC: ALPHACORE INC            Topic: 20A001

    Alphacore will evaluate and develop a new approach to multi-scale modeling of radiation effects in electronic device technologies based on novel material systems. Our approach aims to directly correlate nano-scale properties of novel materials systems with macro-scale electrical properties of devices constructed with those materials, and their radiation response. Radiation hardness assurance (RHA) ...

    STTR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  8. Rapid Counterfeit Detection System by Grafting DNA Taggants to NanoCrystal Cellulose

    SBC: PRIXARC LLC            Topic: DMEA201001

    Prixarc will develop and commercialize a secure and rapid counterfeit detection system using botanical DNA taggants grafted to NanoCrystal Cellulose (NCC) to safeguard electronic components in supply chains and to protect against counterfeiting and diversion. We will advance the science behind grafting of botanical DNA taggants to NCC, along with its application to semiconductors and microchips. O ...

    SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  9. Robust Readout of DNA Marking for Electronic Counterfeit Detection

    SBC: CFD RESEARCH CORPORATION            Topic: DMEA201001

    Counterfeiting of electronics in the supply chain such as discrete electronic components, integrated circuits, and electronic sub-assemblies is a major issue for the DoD. Failures arising from counterfeit parts pose a security risk, affect system integrity, lead to mission delays, and ultimately endanger the lives of the warfighters. Counterfeit components are extremely difficult to detect once th ...

    SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity
  10. Sequencing for Genetic Electronic Assurance: Counterfeit Detection for a Global Supply Chain

    SBC: LUNA INNOVATIONS INCORPORATED            Topic: DMEA201001

    Securing the electronic components of the DOD is a complex challenge. In a global supply chain with thousands of distributed contractors creating high performance systems, it is critically important to ensure counterfeit components are not entering use. Chain of custody of electronic components from the time of manufacture to when the DOD takes delivery of the completed product can involve a multi ...

    SBIR Phase I 2020 Department of DefenseDefense Microelectronics Activity
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