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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.
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Failure Avoidance in Microelectronics through Coefficient of Thermal Expansion (CTE) Mismatch Modeling and DesignSBC: Space Micro Inc. Topic: MDA14T002
Space Micro will develop the core of the decision support system, assemble the models and material properties and demonstrate the utility of the program in materials selection on a subset of failures related to a specific test-bed, which will be the attachment of quad-flat no-leads (QFN) and ball grid array (BGA) devices to printed wiring boards using different solders, underfills, QFN or BGA geom ...STTR Phase I 2015 Department of DefenseMissile Defense Agency
Microelectronics Component Adhesive Selection and Design Rules for Failure AvoidanceSBC: CFD RESEARCH CORP Topic: MDA14T002
Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...STTR Phase I 2015 Department of DefenseMissile Defense Agency