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The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
Microelectronics Component Adhesive Selection and Design Rules for Failure AvoidanceSBC: CFD RESEARCH CORP Topic: MDA14T002
Thermally induced fatigue and residual stress introduced during fabrication are sources of stress related failure in microelectronics, which raises concerns about product reliability and specification. CFDRC has teamed with experts in the reliability of microelectronics packaging to develop a testing and physics based modeling protocol to correlate material properties and thermal loading conditio ...STTR Phase I 2015 Department of DefenseMissile Defense Agency
Light Weight Optics For High Power Directed Energy ApplicationsSBC: BRIMROSE TECHNOLOGY CORP Topic: MDA13T009
The objective of this proposal is to demonstrate the feasibility of producing light weight and thermally manageable integrated optical systems suitable for a variety of space and airborne high power directed energy applications. This project will focus on improving two of the most important parts of a high energy mirror design, the highly reflective mirror surface, and the light weight and stiff m ...STTR Phase II 2015 Department of DefenseMissile Defense Agency