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The Award database is continually updated throughout the year. As a result, data for FY19 is not expected to be complete until April, 2020.

  1. Wafer-Level Electronic-Photonic Co-Packaging

    SBC: Phase Sensitive Innovations, Inc.            Topic: AF16AT01

    In this STTR effort we will develop key packaging techniques for wafer-level hybrid electrical-optical co-packaging based on silicon photonic platform. These techniques include packaging LiNbO3 modulator on insulator (LNOI), high-speed modified uni-traveling carrier (MUTC) photodiodes packaging and high-efficiency fiber coupling. Silicon is the desired host material for photonic integrated circuit ...

    STTR Phase I 2017 Department of DefenseAir Force

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