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INTERMETALLIC COMPOUNDS ARE KNOWN FOR THEIR HIGH MELTING POINTS AND CORROSION AND OXIDATION RESISTANCE. MANY OF THESE COMPOUNDS HAVE LOW DENSITIES AND VERY HIGH STRENGTHS AND, THEREFORE, ARE OF INTEREST FOR HIGH TEMPERATURE AEROSPACE AND SPACE STRUCTURE APPLICATIONS. HOWEVER,CONVENTIONAL PROCESSING OF INTERMETALLIC COMPOUNDS SUFFERS SEVERE LIMITATIONS: REACTIONS WITH CONTAINERS, POROSITY, CONTAMIN ...

THE DEVELOPMENT OF A MANUFACTURING TECHNOLOGY THAT ALLOWS FOR THE OPTIMIZATION OF THE MECHANICAL AND SUPERCONDUCTING PROPERTIES OF HIGH TEMPERATURE SUPERCONDUCTORS IS CRUCIAL FOR THEIR IMPLEMENTATION IN ENERGY STORAGE DEVICES, MOTOR, GENERATORS, AND ELECTROMAGNETIC LAUNCHERS. STATE-OF-THE-ART PROCESSING NOW YIELDS HIGH TEMPERATURE SUPERCONDUCING MATERIALS WITH ENCOURAGING ELECTRICAL PROPERTIES, BU ...

WIDESPREAD APPLICATION OF HIGH PERFORMANCE DEVICES BASED ON III-VI COMPOUND SEMICONDUCTOR WILL DEPEND ON THE DEVELOPMENT OF ECONOMIC AND HIGH-QUALITY MANUFACTURING METHODS. DURING THE LAST FEW YEARS, ORGANOMETALLIC BASED PROCESSES HAVE EVOLVED INTO THE MOST PROMISING TECHNIQUES FOR THE PRODUCTION OF ULTRA-HIGH PURITY COMPOUND SEMICONDUCTOR MATERIALS IN COMPLEX LAYERED STRUCTURES REQUIRED FOR ADVAN ...

RECENT ADVANCES IN HIGH TEMPERATURE SUPERCONDUCTING (HTSC) THIN FILM TECHNOLOGY ENABLE THE FABRICATION OF LOW-LOSS COMPONENTS THAT WILL IMPROVE THE COST AND PERFORMANCE OF CHANNELIZED RECEIVERS. CHANNELIZED RECEIVERS ARE USED IN SATELLITE TRANSPONDER, ELECTRONIC WARFARE AND ELECTRONICS INTELLIGENCE APPLICATIONS AND ARE COMPRISED OF A GROUP OF NARROW BAND RECEIVERS THAT COVER INDIVIDUAL SLOTS IN A ...

SIGNIFICANT SIMPLIFICATION OF MICROWAVE PHASED ARRAY ANTENNA SYSTEM ARCHITECTURES CAN BE ACHIEVED WITH HTSC DEVICE TECHNOLOGY. ELIMINATION OF THE LOW NOISE AMPLIFIERS (LNAS) CAN BE ACCOMPLISHED THROUGH REPLACEMENT OF THE GAAS PHASE SHIFTERS WITH LOW LOSS HTSC COMPONENTS. A REDUCTION IN COMPLEXITY LOWERS BOTH SYSTEM WEIGHT ANDCOST. KEY TO HTSC TECHNOLOGY INSERTION IN PHASED ARRAY ANTENNAS IS THE DE ...

IN-SITU MONITORING OF CRITICAL FILM PROPERTIES WOULD GREATLY ENHANCE PROCESS CONTROL OF THIN FILM COATING TECHNOLOGIES SUCH AS CHEMICAL VAPOR DEPOSITION (CVD) AND PHYSICAL VAPOR DEPOSITION (PVD). ATM, WORKING IN CONJUNCTION WITH PENNSYLVANIA STATE UNIVERSITY, PROPOSES TO INCORPORATE A POSITION SENSITIVE FIBER OPTIC X-RAY SCINTILLATION DETECTOR (PSSD) FOR REAL TIME X-RAY ANALYSIS OF CHEMICALLY VAPO ...

High quality thin films of high temperature superconductor (HTSC) materials have been grown by a variety of methods. Independent of the growth method, residual stresses in large area HTSC/dielectric multi-layer films, resulting from both thermal expansion and lattice mismatch, continue to be a problem. In Phase I, ATM, working with Dr. Stewart Kurtz of Pennsylvania State University, will calculate ...

The demand for higher performance semiconductor devices is pushing the limits of current materials technology. The development of a high dieletric constant capacitor material with 10 - 100 times the charge storage of SiO2 would allow a flat capacitor cell to be used in 256 Mb DRAMs, and simple stacked capacitors to be adopted for 1 and 4 Gb generations. IBM, TI and Micron have entered into an ARPA ...

Chemical vapor deposition (CVD) of copper for vias and interconnects is critical to manufacture of next generation high speed ULSI devices and has been extensively investigated over the last few years. Although considerable progress has been made commercialization of this technology is currently impossible due to the high cost of the source reagents. In this Phase I program Advanced Technology Mat ...

Sensors and electronics will become increasingly pervassive as weight, fuel efficiency, cost and emissions requirements put increasing demands on vehicle technology. The development of high temperture, integrated sensors and electronics is necessary to cost-effectively address both civilian and military needs. The arrival of single crystal silicon carbide substrates and high quality epitaxial laye ...