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Award Data
The Award database is continually updated throughout the year. As a result, data for FY22 is not expected to be complete until September, 2023.
Download all SBIR.gov award data either with award abstracts (290MB)
or without award abstracts (65MB).
A data dictionary and additional information is located on the Data Resource Page. Files are refreshed monthly.
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Affordable Integrated Circuit Packaging and Assembly for High-Temperature Intelligent Components
SBC: MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION Topic: AF16AT17Micro-RDC proposes to demonstrate the feasibility of developing low-cost, low-weight, reliable packaging materials and processes to produce low-power advanced Integrated Circuits (ICs) that can operate continuously at temperatures between -55C and +225...
STTR Phase I 2016 Department of DefenseAir Force