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Affordable Integrated Circuit Packaging and Assembly for High-Temperature Intelligent ComponentsSBC: MICROELECTRONICS RESEARCH DEVELOPMENT CORPORATION Topic: AF16AT17
Micro-RDC proposes to demonstrate the feasibility of developing low-cost, low-weight, reliable packaging materials and processes to produce low-power advanced Integrated Circuits (ICs) that can operate continuously at temperatures between -55C and +225...STTR Phase I 2016 Department of DefenseAir Force